Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior
Abstract In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of addi...
Ausführliche Beschreibung
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| Autor*in: |
Huang, Timothy B. [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2018 |
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| Schlagwörter: |
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| Anmerkung: |
© The Minerals, Metals & Materials Society 2018 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Warrendale, Pa : TMS, 1972, 47(2018), 12 vom: 21. Sept., Seite 7401-7408 |
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| Übergeordnetes Werk: |
volume:47 ; year:2018 ; number:12 ; day:21 ; month:09 ; pages:7401-7408 |
| Links: |
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| DOI / URN: |
10.1007/s11664-018-6680-0 |
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| Katalog-ID: |
SPR021546630 |
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| 245 | 1 | 0 | |a Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior |
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| 520 | |a Abstract In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of additive combinations to the Cu cathode. Of the polyalkylene glycol (PAG) suppressors investigated, polypropylene glycol was in general a weaker suppressor than polyethylene glycol, showing weaker polarization of the Cu cathode and faster depolarization when combined with bis(sodium sulfopropyl)disulfide (SPS). The rapid depolarization of PAG with SPS resulted in a conformal Cu filling behavior in blind-vias. By itself, the leveler molecule polyvinyl pyrrolidone (PVP) shows very weak and slow suppression compared to the PAG-type suppressors, but depolarization of the Cu cathode is prevented when combined with SPS. The weak polarization of PVP combined with SPS resulted in sub-conformal filling behavior in blind-vias. The potential response of SPS, PAG, and PVP combined was found to be the sum of their individual interactions: PAG adsorbs rapidly to strongly polarize the cathode, but PVP prevents depolarization with time from SPS. This strong and consistent polarization outside the vias resulted in a superconformal filling behavior, with more than twice the thickness of Cu plated in the vias than outside. | ||
| 650 | 4 | |a Copper |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a electroplating |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a metallization |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Sharma, Himani |4 aut | |
| 700 | 1 | |a Manepalli, Rahul |4 aut | |
| 700 | 1 | |a Kandanur, Sashi |4 aut | |
| 700 | 1 | |a Sundaram, Venky |4 aut | |
| 700 | 1 | |a Tummala, Rao R. |4 aut | |
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10.1007/s11664-018-6680-0 doi (DE-627)SPR021546630 (SPR)s11664-018-6680-0-e DE-627 ger DE-627 rakwb eng Huang, Timothy B. verfasserin (orcid)0000-0003-0244-2382 aut Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior 2018 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2018 Abstract In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of additive combinations to the Cu cathode. Of the polyalkylene glycol (PAG) suppressors investigated, polypropylene glycol was in general a weaker suppressor than polyethylene glycol, showing weaker polarization of the Cu cathode and faster depolarization when combined with bis(sodium sulfopropyl)disulfide (SPS). The rapid depolarization of PAG with SPS resulted in a conformal Cu filling behavior in blind-vias. By itself, the leveler molecule polyvinyl pyrrolidone (PVP) shows very weak and slow suppression compared to the PAG-type suppressors, but depolarization of the Cu cathode is prevented when combined with SPS. The weak polarization of PVP combined with SPS resulted in sub-conformal filling behavior in blind-vias. The potential response of SPS, PAG, and PVP combined was found to be the sum of their individual interactions: PAG adsorbs rapidly to strongly polarize the cathode, but PVP prevents depolarization with time from SPS. This strong and consistent polarization outside the vias resulted in a superconformal filling behavior, with more than twice the thickness of Cu plated in the vias than outside. Copper (dpeaa)DE-He213 electroplating (dpeaa)DE-He213 metallization (dpeaa)DE-He213 Sharma, Himani aut Manepalli, Rahul aut Kandanur, Sashi aut Sundaram, Venky aut Tummala, Rao R. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 47(2018), 12 vom: 21. Sept., Seite 7401-7408 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:47 year:2018 number:12 day:21 month:09 pages:7401-7408 https://dx.doi.org/10.1007/s11664-018-6680-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 47 2018 12 21 09 7401-7408 |
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10.1007/s11664-018-6680-0 doi (DE-627)SPR021546630 (SPR)s11664-018-6680-0-e DE-627 ger DE-627 rakwb eng Huang, Timothy B. verfasserin (orcid)0000-0003-0244-2382 aut Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior 2018 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2018 Abstract In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of additive combinations to the Cu cathode. Of the polyalkylene glycol (PAG) suppressors investigated, polypropylene glycol was in general a weaker suppressor than polyethylene glycol, showing weaker polarization of the Cu cathode and faster depolarization when combined with bis(sodium sulfopropyl)disulfide (SPS). The rapid depolarization of PAG with SPS resulted in a conformal Cu filling behavior in blind-vias. By itself, the leveler molecule polyvinyl pyrrolidone (PVP) shows very weak and slow suppression compared to the PAG-type suppressors, but depolarization of the Cu cathode is prevented when combined with SPS. The weak polarization of PVP combined with SPS resulted in sub-conformal filling behavior in blind-vias. The potential response of SPS, PAG, and PVP combined was found to be the sum of their individual interactions: PAG adsorbs rapidly to strongly polarize the cathode, but PVP prevents depolarization with time from SPS. This strong and consistent polarization outside the vias resulted in a superconformal filling behavior, with more than twice the thickness of Cu plated in the vias than outside. Copper (dpeaa)DE-He213 electroplating (dpeaa)DE-He213 metallization (dpeaa)DE-He213 Sharma, Himani aut Manepalli, Rahul aut Kandanur, Sashi aut Sundaram, Venky aut Tummala, Rao R. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 47(2018), 12 vom: 21. Sept., Seite 7401-7408 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:47 year:2018 number:12 day:21 month:09 pages:7401-7408 https://dx.doi.org/10.1007/s11664-018-6680-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 47 2018 12 21 09 7401-7408 |
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10.1007/s11664-018-6680-0 doi (DE-627)SPR021546630 (SPR)s11664-018-6680-0-e DE-627 ger DE-627 rakwb eng Huang, Timothy B. verfasserin (orcid)0000-0003-0244-2382 aut Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior 2018 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2018 Abstract In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of additive combinations to the Cu cathode. Of the polyalkylene glycol (PAG) suppressors investigated, polypropylene glycol was in general a weaker suppressor than polyethylene glycol, showing weaker polarization of the Cu cathode and faster depolarization when combined with bis(sodium sulfopropyl)disulfide (SPS). The rapid depolarization of PAG with SPS resulted in a conformal Cu filling behavior in blind-vias. By itself, the leveler molecule polyvinyl pyrrolidone (PVP) shows very weak and slow suppression compared to the PAG-type suppressors, but depolarization of the Cu cathode is prevented when combined with SPS. The weak polarization of PVP combined with SPS resulted in sub-conformal filling behavior in blind-vias. The potential response of SPS, PAG, and PVP combined was found to be the sum of their individual interactions: PAG adsorbs rapidly to strongly polarize the cathode, but PVP prevents depolarization with time from SPS. This strong and consistent polarization outside the vias resulted in a superconformal filling behavior, with more than twice the thickness of Cu plated in the vias than outside. Copper (dpeaa)DE-He213 electroplating (dpeaa)DE-He213 metallization (dpeaa)DE-He213 Sharma, Himani aut Manepalli, Rahul aut Kandanur, Sashi aut Sundaram, Venky aut Tummala, Rao R. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 47(2018), 12 vom: 21. Sept., Seite 7401-7408 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:47 year:2018 number:12 day:21 month:09 pages:7401-7408 https://dx.doi.org/10.1007/s11664-018-6680-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 47 2018 12 21 09 7401-7408 |
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10.1007/s11664-018-6680-0 doi (DE-627)SPR021546630 (SPR)s11664-018-6680-0-e DE-627 ger DE-627 rakwb eng Huang, Timothy B. verfasserin (orcid)0000-0003-0244-2382 aut Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior 2018 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2018 Abstract In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of additive combinations to the Cu cathode. Of the polyalkylene glycol (PAG) suppressors investigated, polypropylene glycol was in general a weaker suppressor than polyethylene glycol, showing weaker polarization of the Cu cathode and faster depolarization when combined with bis(sodium sulfopropyl)disulfide (SPS). The rapid depolarization of PAG with SPS resulted in a conformal Cu filling behavior in blind-vias. By itself, the leveler molecule polyvinyl pyrrolidone (PVP) shows very weak and slow suppression compared to the PAG-type suppressors, but depolarization of the Cu cathode is prevented when combined with SPS. The weak polarization of PVP combined with SPS resulted in sub-conformal filling behavior in blind-vias. The potential response of SPS, PAG, and PVP combined was found to be the sum of their individual interactions: PAG adsorbs rapidly to strongly polarize the cathode, but PVP prevents depolarization with time from SPS. This strong and consistent polarization outside the vias resulted in a superconformal filling behavior, with more than twice the thickness of Cu plated in the vias than outside. Copper (dpeaa)DE-He213 electroplating (dpeaa)DE-He213 metallization (dpeaa)DE-He213 Sharma, Himani aut Manepalli, Rahul aut Kandanur, Sashi aut Sundaram, Venky aut Tummala, Rao R. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 47(2018), 12 vom: 21. Sept., Seite 7401-7408 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:47 year:2018 number:12 day:21 month:09 pages:7401-7408 https://dx.doi.org/10.1007/s11664-018-6680-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 47 2018 12 21 09 7401-7408 |
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10.1007/s11664-018-6680-0 doi (DE-627)SPR021546630 (SPR)s11664-018-6680-0-e DE-627 ger DE-627 rakwb eng Huang, Timothy B. verfasserin (orcid)0000-0003-0244-2382 aut Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior 2018 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2018 Abstract In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of additive combinations to the Cu cathode. Of the polyalkylene glycol (PAG) suppressors investigated, polypropylene glycol was in general a weaker suppressor than polyethylene glycol, showing weaker polarization of the Cu cathode and faster depolarization when combined with bis(sodium sulfopropyl)disulfide (SPS). The rapid depolarization of PAG with SPS resulted in a conformal Cu filling behavior in blind-vias. By itself, the leveler molecule polyvinyl pyrrolidone (PVP) shows very weak and slow suppression compared to the PAG-type suppressors, but depolarization of the Cu cathode is prevented when combined with SPS. The weak polarization of PVP combined with SPS resulted in sub-conformal filling behavior in blind-vias. The potential response of SPS, PAG, and PVP combined was found to be the sum of their individual interactions: PAG adsorbs rapidly to strongly polarize the cathode, but PVP prevents depolarization with time from SPS. This strong and consistent polarization outside the vias resulted in a superconformal filling behavior, with more than twice the thickness of Cu plated in the vias than outside. Copper (dpeaa)DE-He213 electroplating (dpeaa)DE-He213 metallization (dpeaa)DE-He213 Sharma, Himani aut Manepalli, Rahul aut Kandanur, Sashi aut Sundaram, Venky aut Tummala, Rao R. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 47(2018), 12 vom: 21. Sept., Seite 7401-7408 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:47 year:2018 number:12 day:21 month:09 pages:7401-7408 https://dx.doi.org/10.1007/s11664-018-6680-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 47 2018 12 21 09 7401-7408 |
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Huang, Timothy B. @@aut@@ Sharma, Himani @@aut@@ Manepalli, Rahul @@aut@@ Kandanur, Sashi @@aut@@ Sundaram, Venky @@aut@@ Tummala, Rao R. @@aut@@ |
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Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of additive combinations to the Cu cathode. Of the polyalkylene glycol (PAG) suppressors investigated, polypropylene glycol was in general a weaker suppressor than polyethylene glycol, showing weaker polarization of the Cu cathode and faster depolarization when combined with bis(sodium sulfopropyl)disulfide (SPS). The rapid depolarization of PAG with SPS resulted in a conformal Cu filling behavior in blind-vias. By itself, the leveler molecule polyvinyl pyrrolidone (PVP) shows very weak and slow suppression compared to the PAG-type suppressors, but depolarization of the Cu cathode is prevented when combined with SPS. The weak polarization of PVP combined with SPS resulted in sub-conformal filling behavior in blind-vias. The potential response of SPS, PAG, and PVP combined was found to be the sum of their individual interactions: PAG adsorbs rapidly to strongly polarize the cathode, but PVP prevents depolarization with time from SPS. 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| author |
Huang, Timothy B. |
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Huang, Timothy B. misc Copper misc electroplating misc metallization Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior |
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Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior Copper (dpeaa)DE-He213 electroplating (dpeaa)DE-He213 metallization (dpeaa)DE-He213 |
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misc Copper misc electroplating misc metallization |
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misc Copper misc electroplating misc metallization |
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misc Copper misc electroplating misc metallization |
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Elektronische Aufsätze Aufsätze Elektronische Ressource |
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Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior |
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Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior |
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Huang, Timothy B. |
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Journal of electronic materials |
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Huang, Timothy B. Sharma, Himani Manepalli, Rahul Kandanur, Sashi Sundaram, Venky Tummala, Rao R. |
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Huang, Timothy B. |
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10.1007/s11664-018-6680-0 |
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| title_sort |
electroanalytical study of organic additive interactions in copper plating and their correlation with via fill behavior |
| title_auth |
Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior |
| abstract |
Abstract In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of additive combinations to the Cu cathode. Of the polyalkylene glycol (PAG) suppressors investigated, polypropylene glycol was in general a weaker suppressor than polyethylene glycol, showing weaker polarization of the Cu cathode and faster depolarization when combined with bis(sodium sulfopropyl)disulfide (SPS). The rapid depolarization of PAG with SPS resulted in a conformal Cu filling behavior in blind-vias. By itself, the leveler molecule polyvinyl pyrrolidone (PVP) shows very weak and slow suppression compared to the PAG-type suppressors, but depolarization of the Cu cathode is prevented when combined with SPS. The weak polarization of PVP combined with SPS resulted in sub-conformal filling behavior in blind-vias. The potential response of SPS, PAG, and PVP combined was found to be the sum of their individual interactions: PAG adsorbs rapidly to strongly polarize the cathode, but PVP prevents depolarization with time from SPS. This strong and consistent polarization outside the vias resulted in a superconformal filling behavior, with more than twice the thickness of Cu plated in the vias than outside. © The Minerals, Metals & Materials Society 2018 |
| abstractGer |
Abstract In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of additive combinations to the Cu cathode. Of the polyalkylene glycol (PAG) suppressors investigated, polypropylene glycol was in general a weaker suppressor than polyethylene glycol, showing weaker polarization of the Cu cathode and faster depolarization when combined with bis(sodium sulfopropyl)disulfide (SPS). The rapid depolarization of PAG with SPS resulted in a conformal Cu filling behavior in blind-vias. By itself, the leveler molecule polyvinyl pyrrolidone (PVP) shows very weak and slow suppression compared to the PAG-type suppressors, but depolarization of the Cu cathode is prevented when combined with SPS. The weak polarization of PVP combined with SPS resulted in sub-conformal filling behavior in blind-vias. The potential response of SPS, PAG, and PVP combined was found to be the sum of their individual interactions: PAG adsorbs rapidly to strongly polarize the cathode, but PVP prevents depolarization with time from SPS. This strong and consistent polarization outside the vias resulted in a superconformal filling behavior, with more than twice the thickness of Cu plated in the vias than outside. © The Minerals, Metals & Materials Society 2018 |
| abstract_unstemmed |
Abstract In this study, individual interactions between various classes of organic additives in electrolytic copper plating solutions are characterized by electroanalytical methods. Cyclic voltammetry and chronopotentiometry were used to compare cases of sequential and competitive adsorption of additive combinations to the Cu cathode. Of the polyalkylene glycol (PAG) suppressors investigated, polypropylene glycol was in general a weaker suppressor than polyethylene glycol, showing weaker polarization of the Cu cathode and faster depolarization when combined with bis(sodium sulfopropyl)disulfide (SPS). The rapid depolarization of PAG with SPS resulted in a conformal Cu filling behavior in blind-vias. By itself, the leveler molecule polyvinyl pyrrolidone (PVP) shows very weak and slow suppression compared to the PAG-type suppressors, but depolarization of the Cu cathode is prevented when combined with SPS. The weak polarization of PVP combined with SPS resulted in sub-conformal filling behavior in blind-vias. The potential response of SPS, PAG, and PVP combined was found to be the sum of their individual interactions: PAG adsorbs rapidly to strongly polarize the cathode, but PVP prevents depolarization with time from SPS. This strong and consistent polarization outside the vias resulted in a superconformal filling behavior, with more than twice the thickness of Cu plated in the vias than outside. © The Minerals, Metals & Materials Society 2018 |
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Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior |
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Sharma, Himani Manepalli, Rahul Kandanur, Sashi Sundaram, Venky Tummala, Rao R. |
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| score |
7.4011183 |