Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes
Abstract Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare l...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Zhan, Haijiao [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2019 |
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| Schlagwörter: |
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| Anmerkung: |
© The Minerals, Metals & Materials Society 2019 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Warrendale, Pa : TMS, 1972, 48(2019), 5 vom: 24. Jan., Seite 2745-2753 |
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| Übergeordnetes Werk: |
volume:48 ; year:2019 ; number:5 ; day:24 ; month:01 ; pages:2745-2753 |
| Links: |
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| DOI / URN: |
10.1007/s11664-019-06957-6 |
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| Katalog-ID: |
SPR021559899 |
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| 520 | |a Abstract Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × $ 10^{−6} $ Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance. | ||
| 650 | 4 | |a Silver flakes |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a printable electronics |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a solution-phase chemical reduction method |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a screen printing |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Guo, Jiayu |4 aut | |
| 700 | 1 | |a Shen, Jiali |4 aut | |
| 700 | 1 | |a Wang, Xiaorong |4 aut | |
| 700 | 1 | |a Fan, Zhonghua |4 aut | |
| 700 | 1 | |a Guo, Bing |4 aut | |
| 700 | 1 | |a Liu, Wei |4 aut | |
| 700 | 1 | |a Shen, Hangyan |4 aut | |
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10.1007/s11664-019-06957-6 doi (DE-627)SPR021559899 (SPR)s11664-019-06957-6-e DE-627 ger DE-627 rakwb eng Zhan, Haijiao verfasserin aut Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes 2019 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2019 Abstract Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × $ 10^{−6} $ Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance. Silver flakes (dpeaa)DE-He213 printable electronics (dpeaa)DE-He213 solution-phase chemical reduction method (dpeaa)DE-He213 screen printing (dpeaa)DE-He213 Guo, Jiayu aut Shen, Jiali aut Wang, Xiaorong aut Fan, Zhonghua aut Guo, Bing aut Liu, Wei aut Shen, Hangyan aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 48(2019), 5 vom: 24. Jan., Seite 2745-2753 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:48 year:2019 number:5 day:24 month:01 pages:2745-2753 https://dx.doi.org/10.1007/s11664-019-06957-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 48 2019 5 24 01 2745-2753 |
| spelling |
10.1007/s11664-019-06957-6 doi (DE-627)SPR021559899 (SPR)s11664-019-06957-6-e DE-627 ger DE-627 rakwb eng Zhan, Haijiao verfasserin aut Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes 2019 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2019 Abstract Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × $ 10^{−6} $ Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance. Silver flakes (dpeaa)DE-He213 printable electronics (dpeaa)DE-He213 solution-phase chemical reduction method (dpeaa)DE-He213 screen printing (dpeaa)DE-He213 Guo, Jiayu aut Shen, Jiali aut Wang, Xiaorong aut Fan, Zhonghua aut Guo, Bing aut Liu, Wei aut Shen, Hangyan aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 48(2019), 5 vom: 24. Jan., Seite 2745-2753 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:48 year:2019 number:5 day:24 month:01 pages:2745-2753 https://dx.doi.org/10.1007/s11664-019-06957-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 48 2019 5 24 01 2745-2753 |
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10.1007/s11664-019-06957-6 doi (DE-627)SPR021559899 (SPR)s11664-019-06957-6-e DE-627 ger DE-627 rakwb eng Zhan, Haijiao verfasserin aut Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes 2019 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2019 Abstract Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × $ 10^{−6} $ Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance. Silver flakes (dpeaa)DE-He213 printable electronics (dpeaa)DE-He213 solution-phase chemical reduction method (dpeaa)DE-He213 screen printing (dpeaa)DE-He213 Guo, Jiayu aut Shen, Jiali aut Wang, Xiaorong aut Fan, Zhonghua aut Guo, Bing aut Liu, Wei aut Shen, Hangyan aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 48(2019), 5 vom: 24. Jan., Seite 2745-2753 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:48 year:2019 number:5 day:24 month:01 pages:2745-2753 https://dx.doi.org/10.1007/s11664-019-06957-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 48 2019 5 24 01 2745-2753 |
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10.1007/s11664-019-06957-6 doi (DE-627)SPR021559899 (SPR)s11664-019-06957-6-e DE-627 ger DE-627 rakwb eng Zhan, Haijiao verfasserin aut Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes 2019 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2019 Abstract Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × $ 10^{−6} $ Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance. Silver flakes (dpeaa)DE-He213 printable electronics (dpeaa)DE-He213 solution-phase chemical reduction method (dpeaa)DE-He213 screen printing (dpeaa)DE-He213 Guo, Jiayu aut Shen, Jiali aut Wang, Xiaorong aut Fan, Zhonghua aut Guo, Bing aut Liu, Wei aut Shen, Hangyan aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 48(2019), 5 vom: 24. Jan., Seite 2745-2753 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:48 year:2019 number:5 day:24 month:01 pages:2745-2753 https://dx.doi.org/10.1007/s11664-019-06957-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 48 2019 5 24 01 2745-2753 |
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10.1007/s11664-019-06957-6 doi (DE-627)SPR021559899 (SPR)s11664-019-06957-6-e DE-627 ger DE-627 rakwb eng Zhan, Haijiao verfasserin aut Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes 2019 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2019 Abstract Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × $ 10^{−6} $ Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance. Silver flakes (dpeaa)DE-He213 printable electronics (dpeaa)DE-He213 solution-phase chemical reduction method (dpeaa)DE-He213 screen printing (dpeaa)DE-He213 Guo, Jiayu aut Shen, Jiali aut Wang, Xiaorong aut Fan, Zhonghua aut Guo, Bing aut Liu, Wei aut Shen, Hangyan aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 48(2019), 5 vom: 24. Jan., Seite 2745-2753 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:48 year:2019 number:5 day:24 month:01 pages:2745-2753 https://dx.doi.org/10.1007/s11664-019-06957-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 48 2019 5 24 01 2745-2753 |
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Zhan, Haijiao @@aut@@ Guo, Jiayu @@aut@@ Shen, Jiali @@aut@@ Wang, Xiaorong @@aut@@ Fan, Zhonghua @@aut@@ Guo, Bing @@aut@@ Liu, Wei @@aut@@ Shen, Hangyan @@aut@@ |
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One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × $ 10^{−6} $ Ω m. 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| author |
Zhan, Haijiao |
| spellingShingle |
Zhan, Haijiao misc Silver flakes misc printable electronics misc solution-phase chemical reduction method misc screen printing Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes |
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Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes Silver flakes (dpeaa)DE-He213 printable electronics (dpeaa)DE-He213 solution-phase chemical reduction method (dpeaa)DE-He213 screen printing (dpeaa)DE-He213 |
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misc Silver flakes misc printable electronics misc solution-phase chemical reduction method misc screen printing |
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misc Silver flakes misc printable electronics misc solution-phase chemical reduction method misc screen printing |
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misc Silver flakes misc printable electronics misc solution-phase chemical reduction method misc screen printing |
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Elektronische Aufsätze Aufsätze Elektronische Ressource |
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Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes |
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Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes |
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Zhan, Haijiao |
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Journal of electronic materials |
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Zhan, Haijiao Guo, Jiayu Shen, Jiali Wang, Xiaorong Fan, Zhonghua Guo, Bing Liu, Wei Shen, Hangyan |
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Elektronische Aufsätze |
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Zhan, Haijiao |
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10.1007/s11664-019-06957-6 |
| title_sort |
synthesis of silver flakes and their application as conductive filler for low-curing-temperature silver pastes |
| title_auth |
Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes |
| abstract |
Abstract Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × $ 10^{−6} $ Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance. © The Minerals, Metals & Materials Society 2019 |
| abstractGer |
Abstract Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × $ 10^{−6} $ Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance. © The Minerals, Metals & Materials Society 2019 |
| abstract_unstemmed |
Abstract Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × $ 10^{−6} $ Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance. © The Minerals, Metals & Materials Society 2019 |
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5 |
| title_short |
Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes |
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https://dx.doi.org/10.1007/s11664-019-06957-6 |
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Guo, Jiayu Shen, Jiali Wang, Xiaorong Fan, Zhonghua Guo, Bing Liu, Wei Shen, Hangyan |
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Guo, Jiayu Shen, Jiali Wang, Xiaorong Fan, Zhonghua Guo, Bing Liu, Wei Shen, Hangyan |
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| doi_str |
10.1007/s11664-019-06957-6 |
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2024-07-03T23:18:29.570Z |
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| score |
7.3997955 |