The influence of fillers on thermophysical properties of adhesives

Abstract The influence of powder fillers (boron nitride, aluminum powder, processed asbestos) on the thermal conductivity and linear thermal-expansion coefficient of epoxy adhesives has been investigated. It has been shown that the use of powder fillers makes it possible to develop polymer compositi...
Ausführliche Beschreibung

Gespeichert in:

Autor*in:	Petrova, A. P. [verfasserIn] Abeliov, Ya. A. Zuev, A. V.

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2014

Schlagwörter:	adhesive powder fillers thermal conductivity linear thermal-expansion coefficient

Anmerkung:	© Pleiades Publishing, Ltd. 2014

Übergeordnetes Werk:	Enthalten in: Polymer science - Moscow : MAIK Nauka/Interperiodics Publ., 2008, 7(2014), 2 vom: Apr., Seite 93-95
Übergeordnetes Werk:	volume:7 ; year:2014 ; number:2 ; month:04 ; pages:93-95

Links:	Volltext

DOI / URN:	10.1134/S1995421214020154

Katalog-ID:	SPR024591319

Internformat


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allfields	10.1134/S1995421214020154 doi (DE-627)SPR024591319 (SPR)S1995421214020154-e DE-627 ger DE-627 rakwb eng Petrova, A. P. verfasserin aut The influence of fillers on thermophysical properties of adhesives 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Pleiades Publishing, Ltd. 2014 Abstract The influence of powder fillers (boron nitride, aluminum powder, processed asbestos) on the thermal conductivity and linear thermal-expansion coefficient of epoxy adhesives has been investigated. It has been shown that the use of powder fillers makes it possible to develop polymer compositions with a high thermal conductivity. adhesive (dpeaa)DE-He213 powder fillers (dpeaa)DE-He213 thermal conductivity (dpeaa)DE-He213 linear thermal-expansion coefficient (dpeaa)DE-He213 Abeliov, Ya. A. aut Zuev, A. V. aut Enthalten in Polymer science Moscow : MAIK Nauka/Interperiodics Publ., 2008 7(2014), 2 vom: Apr., Seite 93-95 (DE-627)581037715 (DE-600)2455294-X 1995-4220 nnns volume:7 year:2014 number:2 month:04 pages:93-95 https://dx.doi.org/10.1134/S1995421214020154 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 7 2014 2 04 93-95
spelling	10.1134/S1995421214020154 doi (DE-627)SPR024591319 (SPR)S1995421214020154-e DE-627 ger DE-627 rakwb eng Petrova, A. P. verfasserin aut The influence of fillers on thermophysical properties of adhesives 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Pleiades Publishing, Ltd. 2014 Abstract The influence of powder fillers (boron nitride, aluminum powder, processed asbestos) on the thermal conductivity and linear thermal-expansion coefficient of epoxy adhesives has been investigated. It has been shown that the use of powder fillers makes it possible to develop polymer compositions with a high thermal conductivity. adhesive (dpeaa)DE-He213 powder fillers (dpeaa)DE-He213 thermal conductivity (dpeaa)DE-He213 linear thermal-expansion coefficient (dpeaa)DE-He213 Abeliov, Ya. A. aut Zuev, A. V. aut Enthalten in Polymer science Moscow : MAIK Nauka/Interperiodics Publ., 2008 7(2014), 2 vom: Apr., Seite 93-95 (DE-627)581037715 (DE-600)2455294-X 1995-4220 nnns volume:7 year:2014 number:2 month:04 pages:93-95 https://dx.doi.org/10.1134/S1995421214020154 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 7 2014 2 04 93-95
allfields_unstemmed	10.1134/S1995421214020154 doi (DE-627)SPR024591319 (SPR)S1995421214020154-e DE-627 ger DE-627 rakwb eng Petrova, A. P. verfasserin aut The influence of fillers on thermophysical properties of adhesives 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Pleiades Publishing, Ltd. 2014 Abstract The influence of powder fillers (boron nitride, aluminum powder, processed asbestos) on the thermal conductivity and linear thermal-expansion coefficient of epoxy adhesives has been investigated. It has been shown that the use of powder fillers makes it possible to develop polymer compositions with a high thermal conductivity. adhesive (dpeaa)DE-He213 powder fillers (dpeaa)DE-He213 thermal conductivity (dpeaa)DE-He213 linear thermal-expansion coefficient (dpeaa)DE-He213 Abeliov, Ya. A. aut Zuev, A. V. aut Enthalten in Polymer science Moscow : MAIK Nauka/Interperiodics Publ., 2008 7(2014), 2 vom: Apr., Seite 93-95 (DE-627)581037715 (DE-600)2455294-X 1995-4220 nnns volume:7 year:2014 number:2 month:04 pages:93-95 https://dx.doi.org/10.1134/S1995421214020154 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 7 2014 2 04 93-95
allfieldsGer	10.1134/S1995421214020154 doi (DE-627)SPR024591319 (SPR)S1995421214020154-e DE-627 ger DE-627 rakwb eng Petrova, A. P. verfasserin aut The influence of fillers on thermophysical properties of adhesives 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Pleiades Publishing, Ltd. 2014 Abstract The influence of powder fillers (boron nitride, aluminum powder, processed asbestos) on the thermal conductivity and linear thermal-expansion coefficient of epoxy adhesives has been investigated. It has been shown that the use of powder fillers makes it possible to develop polymer compositions with a high thermal conductivity. adhesive (dpeaa)DE-He213 powder fillers (dpeaa)DE-He213 thermal conductivity (dpeaa)DE-He213 linear thermal-expansion coefficient (dpeaa)DE-He213 Abeliov, Ya. A. aut Zuev, A. V. aut Enthalten in Polymer science Moscow : MAIK Nauka/Interperiodics Publ., 2008 7(2014), 2 vom: Apr., Seite 93-95 (DE-627)581037715 (DE-600)2455294-X 1995-4220 nnns volume:7 year:2014 number:2 month:04 pages:93-95 https://dx.doi.org/10.1134/S1995421214020154 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 7 2014 2 04 93-95
allfieldsSound	10.1134/S1995421214020154 doi (DE-627)SPR024591319 (SPR)S1995421214020154-e DE-627 ger DE-627 rakwb eng Petrova, A. P. verfasserin aut The influence of fillers on thermophysical properties of adhesives 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Pleiades Publishing, Ltd. 2014 Abstract The influence of powder fillers (boron nitride, aluminum powder, processed asbestos) on the thermal conductivity and linear thermal-expansion coefficient of epoxy adhesives has been investigated. It has been shown that the use of powder fillers makes it possible to develop polymer compositions with a high thermal conductivity. adhesive (dpeaa)DE-He213 powder fillers (dpeaa)DE-He213 thermal conductivity (dpeaa)DE-He213 linear thermal-expansion coefficient (dpeaa)DE-He213 Abeliov, Ya. A. aut Zuev, A. V. aut Enthalten in Polymer science Moscow : MAIK Nauka/Interperiodics Publ., 2008 7(2014), 2 vom: Apr., Seite 93-95 (DE-627)581037715 (DE-600)2455294-X 1995-4220 nnns volume:7 year:2014 number:2 month:04 pages:93-95 https://dx.doi.org/10.1134/S1995421214020154 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 7 2014 2 04 93-95
language	English
source	Enthalten in Polymer science 7(2014), 2 vom: Apr., Seite 93-95 volume:7 year:2014 number:2 month:04 pages:93-95
sourceStr	Enthalten in Polymer science 7(2014), 2 vom: Apr., Seite 93-95 volume:7 year:2014 number:2 month:04 pages:93-95
format_phy_str_mv	Article
institution	findex.gbv.de
topic_facet	adhesive powder fillers thermal conductivity linear thermal-expansion coefficient
isfreeaccess_bool	false
container_title	Polymer science
authorswithroles_txt_mv	Petrova, A. P. @@aut@@ Abeliov, Ya. A. @@aut@@ Zuev, A. V. @@aut@@
publishDateDaySort_date	2014-04-01T00:00:00Z
hierarchy_top_id	581037715
id	SPR024591319
language_de	englisch
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author	Petrova, A. P.
spellingShingle	Petrova, A. P. misc adhesive misc powder fillers misc thermal conductivity misc linear thermal-expansion coefficient The influence of fillers on thermophysical properties of adhesives
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topic_title	The influence of fillers on thermophysical properties of adhesives adhesive (dpeaa)DE-He213 powder fillers (dpeaa)DE-He213 thermal conductivity (dpeaa)DE-He213 linear thermal-expansion coefficient (dpeaa)DE-He213
topic	misc adhesive misc powder fillers misc thermal conductivity misc linear thermal-expansion coefficient
topic_unstemmed	misc adhesive misc powder fillers misc thermal conductivity misc linear thermal-expansion coefficient
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title	The influence of fillers on thermophysical properties of adhesives
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title_full	The influence of fillers on thermophysical properties of adhesives
author_sort	Petrova, A. P.
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author_browse	Petrova, A. P. Abeliov, Ya. A. Zuev, A. V.
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doi_str_mv	10.1134/S1995421214020154
title_sort	influence of fillers on thermophysical properties of adhesives
title_auth	The influence of fillers on thermophysical properties of adhesives
abstract	Abstract The influence of powder fillers (boron nitride, aluminum powder, processed asbestos) on the thermal conductivity and linear thermal-expansion coefficient of epoxy adhesives has been investigated. It has been shown that the use of powder fillers makes it possible to develop polymer compositions with a high thermal conductivity. © Pleiades Publishing, Ltd. 2014
abstractGer	Abstract The influence of powder fillers (boron nitride, aluminum powder, processed asbestos) on the thermal conductivity and linear thermal-expansion coefficient of epoxy adhesives has been investigated. It has been shown that the use of powder fillers makes it possible to develop polymer compositions with a high thermal conductivity. © Pleiades Publishing, Ltd. 2014
abstract_unstemmed	Abstract The influence of powder fillers (boron nitride, aluminum powder, processed asbestos) on the thermal conductivity and linear thermal-expansion coefficient of epoxy adhesives has been investigated. It has been shown that the use of powder fillers makes it possible to develop polymer compositions with a high thermal conductivity. © Pleiades Publishing, Ltd. 2014
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container_issue	2
title_short	The influence of fillers on thermophysical properties of adhesives
url	https://dx.doi.org/10.1134/S1995421214020154
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author2	Abeliov, Ya. A. Zuev, A. V.
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The influence of fillers on thermophysical properties of adhesives

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