Performance projections for ballistic carbon nanotube FinFET at circuit level
Abstract A novel three-dimensional device structure for a carbon nanotube (CNT) fin field-effect transistor (FinFET) is proposed and evaluated. We evaluated the potential of the CNT FinFET compared with a Si FinFET at a 22-nm node at the circuit level using three performance metrics including propag...
Ausführliche Beschreibung
Autor*in: |
Zhang, Panpan [verfasserIn] |
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Format: |
E-Artikel |
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Sprache: |
Englisch |
Erschienen: |
2016 |
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Schlagwörter: |
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Anmerkung: |
© Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016 |
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Übergeordnetes Werk: |
Enthalten in: Nano research - [S.l.] : Tsinghua Press, 2008, 9(2016), 6 vom: 13. Apr., Seite 1785-1794 |
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Übergeordnetes Werk: |
volume:9 ; year:2016 ; number:6 ; day:13 ; month:04 ; pages:1785-1794 |
Links: |
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DOI / URN: |
10.1007/s12274-016-1071-4 |
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Katalog-ID: |
SPR024719129 |
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245 | 1 | 0 | |a Performance projections for ballistic carbon nanotube FinFET at circuit level |
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520 | |a Abstract A novel three-dimensional device structure for a carbon nanotube (CNT) fin field-effect transistor (FinFET) is proposed and evaluated. We evaluated the potential of the CNT FinFET compared with a Si FinFET at a 22-nm node at the circuit level using three performance metrics including propagation delay, total power dissipation, and energy-delay product (EDP). Compared with a Si FinFET, the CNT FinFET presents obvious advantages in speed and EDP arising from its almost much larger current density but also results in a higher total power dissipation, especially at a low threshold voltage (Vth = 1/3Vdd). A suitable improvement in Vth can effectively contribute to a significant suppression of leakage current and power dissipation, and then an obvious optimization is obtained in the EDP with an acceptable sacrifice in speed. In particular, CNT FinFETs with optimized threshold voltages can provide an EDP advantage of approximately 50 times over Si FinFETs under a low supply voltage (Vdd = 0.4 V), suggesting great potential for CNT FinFET-based integrated circuits. | ||
650 | 4 | |a carbon nanotube |7 (dpeaa)DE-He213 | |
650 | 4 | |a fin field-effect transistor (FinFET) |7 (dpeaa)DE-He213 | |
650 | 4 | |a integrated circuits |7 (dpeaa)DE-He213 | |
650 | 4 | |a multi-threshold voltage |7 (dpeaa)DE-He213 | |
700 | 1 | |a Qiu, Chenguang |4 aut | |
700 | 1 | |a Zhang, Zhiyong |4 aut | |
700 | 1 | |a Ding, Li |4 aut | |
700 | 1 | |a Chen, Bingyan |4 aut | |
700 | 1 | |a Peng, Lianmao |4 aut | |
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10.1007/s12274-016-1071-4 doi (DE-627)SPR024719129 (SPR)s12274-016-1071-4-e DE-627 ger DE-627 rakwb eng Zhang, Panpan verfasserin aut Performance projections for ballistic carbon nanotube FinFET at circuit level 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016 Abstract A novel three-dimensional device structure for a carbon nanotube (CNT) fin field-effect transistor (FinFET) is proposed and evaluated. We evaluated the potential of the CNT FinFET compared with a Si FinFET at a 22-nm node at the circuit level using three performance metrics including propagation delay, total power dissipation, and energy-delay product (EDP). Compared with a Si FinFET, the CNT FinFET presents obvious advantages in speed and EDP arising from its almost much larger current density but also results in a higher total power dissipation, especially at a low threshold voltage (Vth = 1/3Vdd). A suitable improvement in Vth can effectively contribute to a significant suppression of leakage current and power dissipation, and then an obvious optimization is obtained in the EDP with an acceptable sacrifice in speed. In particular, CNT FinFETs with optimized threshold voltages can provide an EDP advantage of approximately 50 times over Si FinFETs under a low supply voltage (Vdd = 0.4 V), suggesting great potential for CNT FinFET-based integrated circuits. carbon nanotube (dpeaa)DE-He213 fin field-effect transistor (FinFET) (dpeaa)DE-He213 integrated circuits (dpeaa)DE-He213 multi-threshold voltage (dpeaa)DE-He213 Qiu, Chenguang aut Zhang, Zhiyong aut Ding, Li aut Chen, Bingyan aut Peng, Lianmao aut Enthalten in Nano research [S.l.] : Tsinghua Press, 2008 9(2016), 6 vom: 13. Apr., Seite 1785-1794 (DE-627)57375361X (DE-600)2442216-2 1998-0000 nnns volume:9 year:2016 number:6 day:13 month:04 pages:1785-1794 https://dx.doi.org/10.1007/s12274-016-1071-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 9 2016 6 13 04 1785-1794 |
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10.1007/s12274-016-1071-4 doi (DE-627)SPR024719129 (SPR)s12274-016-1071-4-e DE-627 ger DE-627 rakwb eng Zhang, Panpan verfasserin aut Performance projections for ballistic carbon nanotube FinFET at circuit level 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016 Abstract A novel three-dimensional device structure for a carbon nanotube (CNT) fin field-effect transistor (FinFET) is proposed and evaluated. We evaluated the potential of the CNT FinFET compared with a Si FinFET at a 22-nm node at the circuit level using three performance metrics including propagation delay, total power dissipation, and energy-delay product (EDP). Compared with a Si FinFET, the CNT FinFET presents obvious advantages in speed and EDP arising from its almost much larger current density but also results in a higher total power dissipation, especially at a low threshold voltage (Vth = 1/3Vdd). A suitable improvement in Vth can effectively contribute to a significant suppression of leakage current and power dissipation, and then an obvious optimization is obtained in the EDP with an acceptable sacrifice in speed. In particular, CNT FinFETs with optimized threshold voltages can provide an EDP advantage of approximately 50 times over Si FinFETs under a low supply voltage (Vdd = 0.4 V), suggesting great potential for CNT FinFET-based integrated circuits. carbon nanotube (dpeaa)DE-He213 fin field-effect transistor (FinFET) (dpeaa)DE-He213 integrated circuits (dpeaa)DE-He213 multi-threshold voltage (dpeaa)DE-He213 Qiu, Chenguang aut Zhang, Zhiyong aut Ding, Li aut Chen, Bingyan aut Peng, Lianmao aut Enthalten in Nano research [S.l.] : Tsinghua Press, 2008 9(2016), 6 vom: 13. Apr., Seite 1785-1794 (DE-627)57375361X (DE-600)2442216-2 1998-0000 nnns volume:9 year:2016 number:6 day:13 month:04 pages:1785-1794 https://dx.doi.org/10.1007/s12274-016-1071-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 9 2016 6 13 04 1785-1794 |
allfields_unstemmed |
10.1007/s12274-016-1071-4 doi (DE-627)SPR024719129 (SPR)s12274-016-1071-4-e DE-627 ger DE-627 rakwb eng Zhang, Panpan verfasserin aut Performance projections for ballistic carbon nanotube FinFET at circuit level 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016 Abstract A novel three-dimensional device structure for a carbon nanotube (CNT) fin field-effect transistor (FinFET) is proposed and evaluated. We evaluated the potential of the CNT FinFET compared with a Si FinFET at a 22-nm node at the circuit level using three performance metrics including propagation delay, total power dissipation, and energy-delay product (EDP). Compared with a Si FinFET, the CNT FinFET presents obvious advantages in speed and EDP arising from its almost much larger current density but also results in a higher total power dissipation, especially at a low threshold voltage (Vth = 1/3Vdd). A suitable improvement in Vth can effectively contribute to a significant suppression of leakage current and power dissipation, and then an obvious optimization is obtained in the EDP with an acceptable sacrifice in speed. In particular, CNT FinFETs with optimized threshold voltages can provide an EDP advantage of approximately 50 times over Si FinFETs under a low supply voltage (Vdd = 0.4 V), suggesting great potential for CNT FinFET-based integrated circuits. carbon nanotube (dpeaa)DE-He213 fin field-effect transistor (FinFET) (dpeaa)DE-He213 integrated circuits (dpeaa)DE-He213 multi-threshold voltage (dpeaa)DE-He213 Qiu, Chenguang aut Zhang, Zhiyong aut Ding, Li aut Chen, Bingyan aut Peng, Lianmao aut Enthalten in Nano research [S.l.] : Tsinghua Press, 2008 9(2016), 6 vom: 13. Apr., Seite 1785-1794 (DE-627)57375361X (DE-600)2442216-2 1998-0000 nnns volume:9 year:2016 number:6 day:13 month:04 pages:1785-1794 https://dx.doi.org/10.1007/s12274-016-1071-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 9 2016 6 13 04 1785-1794 |
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10.1007/s12274-016-1071-4 doi (DE-627)SPR024719129 (SPR)s12274-016-1071-4-e DE-627 ger DE-627 rakwb eng Zhang, Panpan verfasserin aut Performance projections for ballistic carbon nanotube FinFET at circuit level 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016 Abstract A novel three-dimensional device structure for a carbon nanotube (CNT) fin field-effect transistor (FinFET) is proposed and evaluated. We evaluated the potential of the CNT FinFET compared with a Si FinFET at a 22-nm node at the circuit level using three performance metrics including propagation delay, total power dissipation, and energy-delay product (EDP). Compared with a Si FinFET, the CNT FinFET presents obvious advantages in speed and EDP arising from its almost much larger current density but also results in a higher total power dissipation, especially at a low threshold voltage (Vth = 1/3Vdd). A suitable improvement in Vth can effectively contribute to a significant suppression of leakage current and power dissipation, and then an obvious optimization is obtained in the EDP with an acceptable sacrifice in speed. In particular, CNT FinFETs with optimized threshold voltages can provide an EDP advantage of approximately 50 times over Si FinFETs under a low supply voltage (Vdd = 0.4 V), suggesting great potential for CNT FinFET-based integrated circuits. carbon nanotube (dpeaa)DE-He213 fin field-effect transistor (FinFET) (dpeaa)DE-He213 integrated circuits (dpeaa)DE-He213 multi-threshold voltage (dpeaa)DE-He213 Qiu, Chenguang aut Zhang, Zhiyong aut Ding, Li aut Chen, Bingyan aut Peng, Lianmao aut Enthalten in Nano research [S.l.] : Tsinghua Press, 2008 9(2016), 6 vom: 13. Apr., Seite 1785-1794 (DE-627)57375361X (DE-600)2442216-2 1998-0000 nnns volume:9 year:2016 number:6 day:13 month:04 pages:1785-1794 https://dx.doi.org/10.1007/s12274-016-1071-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 9 2016 6 13 04 1785-1794 |
allfieldsSound |
10.1007/s12274-016-1071-4 doi (DE-627)SPR024719129 (SPR)s12274-016-1071-4-e DE-627 ger DE-627 rakwb eng Zhang, Panpan verfasserin aut Performance projections for ballistic carbon nanotube FinFET at circuit level 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016 Abstract A novel three-dimensional device structure for a carbon nanotube (CNT) fin field-effect transistor (FinFET) is proposed and evaluated. We evaluated the potential of the CNT FinFET compared with a Si FinFET at a 22-nm node at the circuit level using three performance metrics including propagation delay, total power dissipation, and energy-delay product (EDP). Compared with a Si FinFET, the CNT FinFET presents obvious advantages in speed and EDP arising from its almost much larger current density but also results in a higher total power dissipation, especially at a low threshold voltage (Vth = 1/3Vdd). A suitable improvement in Vth can effectively contribute to a significant suppression of leakage current and power dissipation, and then an obvious optimization is obtained in the EDP with an acceptable sacrifice in speed. In particular, CNT FinFETs with optimized threshold voltages can provide an EDP advantage of approximately 50 times over Si FinFETs under a low supply voltage (Vdd = 0.4 V), suggesting great potential for CNT FinFET-based integrated circuits. carbon nanotube (dpeaa)DE-He213 fin field-effect transistor (FinFET) (dpeaa)DE-He213 integrated circuits (dpeaa)DE-He213 multi-threshold voltage (dpeaa)DE-He213 Qiu, Chenguang aut Zhang, Zhiyong aut Ding, Li aut Chen, Bingyan aut Peng, Lianmao aut Enthalten in Nano research [S.l.] : Tsinghua Press, 2008 9(2016), 6 vom: 13. Apr., Seite 1785-1794 (DE-627)57375361X (DE-600)2442216-2 1998-0000 nnns volume:9 year:2016 number:6 day:13 month:04 pages:1785-1794 https://dx.doi.org/10.1007/s12274-016-1071-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 9 2016 6 13 04 1785-1794 |
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English |
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Enthalten in Nano research 9(2016), 6 vom: 13. Apr., Seite 1785-1794 volume:9 year:2016 number:6 day:13 month:04 pages:1785-1794 |
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Enthalten in Nano research 9(2016), 6 vom: 13. Apr., Seite 1785-1794 volume:9 year:2016 number:6 day:13 month:04 pages:1785-1794 |
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Zhang, Panpan @@aut@@ Qiu, Chenguang @@aut@@ Zhang, Zhiyong @@aut@@ Ding, Li @@aut@@ Chen, Bingyan @@aut@@ Peng, Lianmao @@aut@@ |
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Zhang, Panpan misc carbon nanotube misc fin field-effect transistor (FinFET) misc integrated circuits misc multi-threshold voltage Performance projections for ballistic carbon nanotube FinFET at circuit level |
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Performance projections for ballistic carbon nanotube FinFET at circuit level carbon nanotube (dpeaa)DE-He213 fin field-effect transistor (FinFET) (dpeaa)DE-He213 integrated circuits (dpeaa)DE-He213 multi-threshold voltage (dpeaa)DE-He213 |
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performance projections for ballistic carbon nanotube finfet at circuit level |
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Performance projections for ballistic carbon nanotube FinFET at circuit level |
abstract |
Abstract A novel three-dimensional device structure for a carbon nanotube (CNT) fin field-effect transistor (FinFET) is proposed and evaluated. We evaluated the potential of the CNT FinFET compared with a Si FinFET at a 22-nm node at the circuit level using three performance metrics including propagation delay, total power dissipation, and energy-delay product (EDP). Compared with a Si FinFET, the CNT FinFET presents obvious advantages in speed and EDP arising from its almost much larger current density but also results in a higher total power dissipation, especially at a low threshold voltage (Vth = 1/3Vdd). A suitable improvement in Vth can effectively contribute to a significant suppression of leakage current and power dissipation, and then an obvious optimization is obtained in the EDP with an acceptable sacrifice in speed. In particular, CNT FinFETs with optimized threshold voltages can provide an EDP advantage of approximately 50 times over Si FinFETs under a low supply voltage (Vdd = 0.4 V), suggesting great potential for CNT FinFET-based integrated circuits. © Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016 |
abstractGer |
Abstract A novel three-dimensional device structure for a carbon nanotube (CNT) fin field-effect transistor (FinFET) is proposed and evaluated. We evaluated the potential of the CNT FinFET compared with a Si FinFET at a 22-nm node at the circuit level using three performance metrics including propagation delay, total power dissipation, and energy-delay product (EDP). Compared with a Si FinFET, the CNT FinFET presents obvious advantages in speed and EDP arising from its almost much larger current density but also results in a higher total power dissipation, especially at a low threshold voltage (Vth = 1/3Vdd). A suitable improvement in Vth can effectively contribute to a significant suppression of leakage current and power dissipation, and then an obvious optimization is obtained in the EDP with an acceptable sacrifice in speed. In particular, CNT FinFETs with optimized threshold voltages can provide an EDP advantage of approximately 50 times over Si FinFETs under a low supply voltage (Vdd = 0.4 V), suggesting great potential for CNT FinFET-based integrated circuits. © Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016 |
abstract_unstemmed |
Abstract A novel three-dimensional device structure for a carbon nanotube (CNT) fin field-effect transistor (FinFET) is proposed and evaluated. We evaluated the potential of the CNT FinFET compared with a Si FinFET at a 22-nm node at the circuit level using three performance metrics including propagation delay, total power dissipation, and energy-delay product (EDP). Compared with a Si FinFET, the CNT FinFET presents obvious advantages in speed and EDP arising from its almost much larger current density but also results in a higher total power dissipation, especially at a low threshold voltage (Vth = 1/3Vdd). A suitable improvement in Vth can effectively contribute to a significant suppression of leakage current and power dissipation, and then an obvious optimization is obtained in the EDP with an acceptable sacrifice in speed. In particular, CNT FinFETs with optimized threshold voltages can provide an EDP advantage of approximately 50 times over Si FinFETs under a low supply voltage (Vdd = 0.4 V), suggesting great potential for CNT FinFET-based integrated circuits. © Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016 |
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title_short |
Performance projections for ballistic carbon nanotube FinFET at circuit level |
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https://dx.doi.org/10.1007/s12274-016-1071-4 |
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Qiu, Chenguang Zhang, Zhiyong Ding, Li Chen, Bingyan Peng, Lianmao |
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Qiu, Chenguang Zhang, Zhiyong Ding, Li Chen, Bingyan Peng, Lianmao |
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10.1007/s12274-016-1071-4 |
up_date |
2024-07-04T02:06:36.246Z |
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score |
7.3974285 |