Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate
Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also exam...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Chen, Wenxue [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2009 |
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| Schlagwörter: |
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| Anmerkung: |
© Journal Publishing Center of University of Science and Technology Beijing and Springer Berlin Heidelberg 2009 |
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| Übergeordnetes Werk: |
Enthalten in: Rare metals - Beijing : Yejin Gongye Chubanshe, 1989, 28(2009), 6 vom: 10. Dez. |
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| Übergeordnetes Werk: |
volume:28 ; year:2009 ; number:6 ; day:10 ; month:12 |
| Links: |
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| DOI / URN: |
10.1007/s12598-009-0125-0 |
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| Katalog-ID: |
SPR026245493 |
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| 245 | 1 | 0 | |a Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate |
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| 520 | |a Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-$ AgZn_{3} $ from the liquid solder on preformed interfacial intermetallics ($ Cu_{5} %$ Zn_{8} $). The peripheral $ AgZn_{3} $, nodular on the $ Cu_{5} %$ Zn_{8} $ IMCs layer, is likely to be generated by a peritectic reaction L + γ-$ Ag_{5} %$ Zn_{8} $ → ɛ-$ AgZn_{3} $ and the following crystallization of $ AgZn_{3} $. | ||
| 650 | 4 | |a soldering materials |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a lead-free solder |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a wettability |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a intermetallic compounds |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Xue, Songbai |4 aut | |
| 700 | 1 | |a Wang, Hui |4 aut | |
| 700 | 1 | |a Wang, Jianxin |4 aut | |
| 700 | 1 | |a Han, Zongjie |4 aut | |
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10.1007/s12598-009-0125-0 doi (DE-627)SPR026245493 (SPR)s12598-009-0125-0-e DE-627 ger DE-627 rakwb eng Chen, Wenxue verfasserin aut Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate 2009 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Journal Publishing Center of University of Science and Technology Beijing and Springer Berlin Heidelberg 2009 Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-$ AgZn_{3} $ from the liquid solder on preformed interfacial intermetallics ($ Cu_{5} %$ Zn_{8} $). The peripheral $ AgZn_{3} $, nodular on the $ Cu_{5} %$ Zn_{8} $ IMCs layer, is likely to be generated by a peritectic reaction L + γ-$ Ag_{5} %$ Zn_{8} $ → ɛ-$ AgZn_{3} $ and the following crystallization of $ AgZn_{3} $. soldering materials (dpeaa)DE-He213 lead-free solder (dpeaa)DE-He213 wettability (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 Xue, Songbai aut Wang, Hui aut Wang, Jianxin aut Han, Zongjie aut Enthalten in Rare metals Beijing : Yejin Gongye Chubanshe, 1989 28(2009), 6 vom: 10. Dez. (DE-627)513219307 (DE-600)2238702-X 1867-7185 nnns volume:28 year:2009 number:6 day:10 month:12 https://dx.doi.org/10.1007/s12598-009-0125-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_374 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_2700 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 28 2009 6 10 12 |
| spelling |
10.1007/s12598-009-0125-0 doi (DE-627)SPR026245493 (SPR)s12598-009-0125-0-e DE-627 ger DE-627 rakwb eng Chen, Wenxue verfasserin aut Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate 2009 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Journal Publishing Center of University of Science and Technology Beijing and Springer Berlin Heidelberg 2009 Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-$ AgZn_{3} $ from the liquid solder on preformed interfacial intermetallics ($ Cu_{5} %$ Zn_{8} $). The peripheral $ AgZn_{3} $, nodular on the $ Cu_{5} %$ Zn_{8} $ IMCs layer, is likely to be generated by a peritectic reaction L + γ-$ Ag_{5} %$ Zn_{8} $ → ɛ-$ AgZn_{3} $ and the following crystallization of $ AgZn_{3} $. soldering materials (dpeaa)DE-He213 lead-free solder (dpeaa)DE-He213 wettability (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 Xue, Songbai aut Wang, Hui aut Wang, Jianxin aut Han, Zongjie aut Enthalten in Rare metals Beijing : Yejin Gongye Chubanshe, 1989 28(2009), 6 vom: 10. Dez. (DE-627)513219307 (DE-600)2238702-X 1867-7185 nnns volume:28 year:2009 number:6 day:10 month:12 https://dx.doi.org/10.1007/s12598-009-0125-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_374 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_2700 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 28 2009 6 10 12 |
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10.1007/s12598-009-0125-0 doi (DE-627)SPR026245493 (SPR)s12598-009-0125-0-e DE-627 ger DE-627 rakwb eng Chen, Wenxue verfasserin aut Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate 2009 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Journal Publishing Center of University of Science and Technology Beijing and Springer Berlin Heidelberg 2009 Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-$ AgZn_{3} $ from the liquid solder on preformed interfacial intermetallics ($ Cu_{5} %$ Zn_{8} $). The peripheral $ AgZn_{3} $, nodular on the $ Cu_{5} %$ Zn_{8} $ IMCs layer, is likely to be generated by a peritectic reaction L + γ-$ Ag_{5} %$ Zn_{8} $ → ɛ-$ AgZn_{3} $ and the following crystallization of $ AgZn_{3} $. soldering materials (dpeaa)DE-He213 lead-free solder (dpeaa)DE-He213 wettability (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 Xue, Songbai aut Wang, Hui aut Wang, Jianxin aut Han, Zongjie aut Enthalten in Rare metals Beijing : Yejin Gongye Chubanshe, 1989 28(2009), 6 vom: 10. Dez. (DE-627)513219307 (DE-600)2238702-X 1867-7185 nnns volume:28 year:2009 number:6 day:10 month:12 https://dx.doi.org/10.1007/s12598-009-0125-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_374 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_2700 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 28 2009 6 10 12 |
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10.1007/s12598-009-0125-0 doi (DE-627)SPR026245493 (SPR)s12598-009-0125-0-e DE-627 ger DE-627 rakwb eng Chen, Wenxue verfasserin aut Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate 2009 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Journal Publishing Center of University of Science and Technology Beijing and Springer Berlin Heidelberg 2009 Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-$ AgZn_{3} $ from the liquid solder on preformed interfacial intermetallics ($ Cu_{5} %$ Zn_{8} $). The peripheral $ AgZn_{3} $, nodular on the $ Cu_{5} %$ Zn_{8} $ IMCs layer, is likely to be generated by a peritectic reaction L + γ-$ Ag_{5} %$ Zn_{8} $ → ɛ-$ AgZn_{3} $ and the following crystallization of $ AgZn_{3} $. soldering materials (dpeaa)DE-He213 lead-free solder (dpeaa)DE-He213 wettability (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 Xue, Songbai aut Wang, Hui aut Wang, Jianxin aut Han, Zongjie aut Enthalten in Rare metals Beijing : Yejin Gongye Chubanshe, 1989 28(2009), 6 vom: 10. Dez. (DE-627)513219307 (DE-600)2238702-X 1867-7185 nnns volume:28 year:2009 number:6 day:10 month:12 https://dx.doi.org/10.1007/s12598-009-0125-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_374 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_2700 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 28 2009 6 10 12 |
| allfieldsSound |
10.1007/s12598-009-0125-0 doi (DE-627)SPR026245493 (SPR)s12598-009-0125-0-e DE-627 ger DE-627 rakwb eng Chen, Wenxue verfasserin aut Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate 2009 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Journal Publishing Center of University of Science and Technology Beijing and Springer Berlin Heidelberg 2009 Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-$ AgZn_{3} $ from the liquid solder on preformed interfacial intermetallics ($ Cu_{5} %$ Zn_{8} $). The peripheral $ AgZn_{3} $, nodular on the $ Cu_{5} %$ Zn_{8} $ IMCs layer, is likely to be generated by a peritectic reaction L + γ-$ Ag_{5} %$ Zn_{8} $ → ɛ-$ AgZn_{3} $ and the following crystallization of $ AgZn_{3} $. soldering materials (dpeaa)DE-He213 lead-free solder (dpeaa)DE-He213 wettability (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 Xue, Songbai aut Wang, Hui aut Wang, Jianxin aut Han, Zongjie aut Enthalten in Rare metals Beijing : Yejin Gongye Chubanshe, 1989 28(2009), 6 vom: 10. Dez. (DE-627)513219307 (DE-600)2238702-X 1867-7185 nnns volume:28 year:2009 number:6 day:10 month:12 https://dx.doi.org/10.1007/s12598-009-0125-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_374 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_2700 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 28 2009 6 10 12 |
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English |
| source |
Enthalten in Rare metals 28(2009), 6 vom: 10. Dez. volume:28 year:2009 number:6 day:10 month:12 |
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Enthalten in Rare metals 28(2009), 6 vom: 10. Dez. volume:28 year:2009 number:6 day:10 month:12 |
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findex.gbv.de |
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soldering materials lead-free solder wettability intermetallic compounds |
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Rare metals |
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Chen, Wenxue @@aut@@ Xue, Songbai @@aut@@ Wang, Hui @@aut@@ Wang, Jianxin @@aut@@ Han, Zongjie @@aut@@ |
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2009-12-10T00:00:00Z |
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<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">SPR026245493</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230331232929.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">201007s2009 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s12598-009-0125-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)SPR026245493</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(SPR)s12598-009-0125-0-e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Chen, Wenxue</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2009</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© Journal Publishing Center of University of Science and Technology Beijing and Springer Berlin Heidelberg 2009</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-$ AgZn_{3} $ from the liquid solder on preformed interfacial intermetallics ($ Cu_{5} %$ Zn_{8} $). 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Chen, Wenxue |
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Chen, Wenxue misc soldering materials misc lead-free solder misc wettability misc intermetallic compounds Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate |
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Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate soldering materials (dpeaa)DE-He213 lead-free solder (dpeaa)DE-He213 wettability (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 |
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misc soldering materials misc lead-free solder misc wettability misc intermetallic compounds |
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Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate |
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Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate |
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Chen, Wenxue Xue, Songbai Wang, Hui Wang, Jianxin Han, Zongjie |
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10.1007/s12598-009-0125-0 |
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solderability and intermetallic compounds formation of sn-9zn-xag lead-free solders wetted on cu substrate |
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Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate |
| abstract |
Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-$ AgZn_{3} $ from the liquid solder on preformed interfacial intermetallics ($ Cu_{5} %$ Zn_{8} $). The peripheral $ AgZn_{3} $, nodular on the $ Cu_{5} %$ Zn_{8} $ IMCs layer, is likely to be generated by a peritectic reaction L + γ-$ Ag_{5} %$ Zn_{8} $ → ɛ-$ AgZn_{3} $ and the following crystallization of $ AgZn_{3} $. © Journal Publishing Center of University of Science and Technology Beijing and Springer Berlin Heidelberg 2009 |
| abstractGer |
Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-$ AgZn_{3} $ from the liquid solder on preformed interfacial intermetallics ($ Cu_{5} %$ Zn_{8} $). The peripheral $ AgZn_{3} $, nodular on the $ Cu_{5} %$ Zn_{8} $ IMCs layer, is likely to be generated by a peritectic reaction L + γ-$ Ag_{5} %$ Zn_{8} $ → ɛ-$ AgZn_{3} $ and the following crystallization of $ AgZn_{3} $. © Journal Publishing Center of University of Science and Technology Beijing and Springer Berlin Heidelberg 2009 |
| abstract_unstemmed |
Abstract The eutectic Sn-9Zn alloy was doped with Ag (0 wt.%-1 wt.%) to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and intermetallic compounds (IMCs) formed at the solder/Cu interface were also examined in this study. The results show that, due to the addition of Ag, the microstructure of the solder changes. When the quantity of Ag is lower than 0.3 wt.%, the needle-like Zn-rich phase decreases gradually. However, when the quantity of Ag is 0.5 wt.%-1 wt.%, Ag-Zn intermetallic compounds appear in the solder. In particular, adding 0.3 wt.% Ag improves the wetting behavior due to the better oxidation resistance of the Sn-9Zn solder. The addition of an excessive amount of Ag will deteriorate the wetting property because the glutinosity and fluidity of Sn-9Zn-(0.5, 1)Ag solder decrease. The results also indicate that the addition of Ag to the Sn-Zn solder leads to the precipitation of ε-$ AgZn_{3} $ from the liquid solder on preformed interfacial intermetallics ($ Cu_{5} %$ Zn_{8} $). The peripheral $ AgZn_{3} $, nodular on the $ Cu_{5} %$ Zn_{8} $ IMCs layer, is likely to be generated by a peritectic reaction L + γ-$ Ag_{5} %$ Zn_{8} $ → ɛ-$ AgZn_{3} $ and the following crystallization of $ AgZn_{3} $. © Journal Publishing Center of University of Science and Technology Beijing and Springer Berlin Heidelberg 2009 |
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| title_short |
Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate |
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https://dx.doi.org/10.1007/s12598-009-0125-0 |
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Xue, Songbai Wang, Hui Wang, Jianxin Han, Zongjie |
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10.1007/s12598-009-0125-0 |
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2024-07-03T19:44:37.344Z |
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| score |
7.3994503 |