A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable

Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as...
Ausführliche Beschreibung

Gespeichert in:
Autor*in:

Tawancy, H. M. [verfasserIn]

Alhems, Luai M. [verfasserIn]

Format:

E-Artikel

Sprache:

Englisch

Erschienen:

2017

Schlagwörter:

Copper shield

Medium-voltage cable

Electron microscopy

Surface analysis

Übergeordnetes Werk:

Enthalten in: Metallography, microstructure, and analysis - New York : Springer US, 2012, 6(2017), 1 vom: 04. Jan., Seite 73-81

Übergeordnetes Werk:

volume:6 ; year:2017 ; number:1 ; day:04 ; month:01 ; pages:73-81

Links:

Volltext

DOI / URN:

10.1007/s13632-016-0328-3

Katalog-ID:

SPR03196026X

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