A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable

Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as...
Ausführliche Beschreibung

Gespeichert in:

Autor*in:	Tawancy, H. M. [verfasserIn] Alhems, Luai M. [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2017

Schlagwörter:	Copper shield Medium-voltage cable Electron microscopy Surface analysis

Übergeordnetes Werk:	Enthalten in: Metallography, microstructure, and analysis - New York : Springer US, 2012, 6(2017), 1 vom: 04. Jan., Seite 73-81
Übergeordnetes Werk:	volume:6 ; year:2017 ; number:1 ; day:04 ; month:01 ; pages:73-81

Links:	Volltext

DOI / URN:	10.1007/s13632-016-0328-3

Katalog-ID:	SPR03196026X

Internformat


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520			\|a Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as localized melting and perforation, (b) distortion and cracking of the outer protection jacket of polyvinyl chloride allowing the copper tape to come into contact with high sulfate-containing soil leading to deposition of $ CuSO_{4} $ on the copper surface, and (c) breakdown of the underlying layer of insulation shield. Most evidence suggests that overheating has been related to high return fault current exceeding the current-carrying capability of the copper tape used in the application. It is concluded that such a problem may be combated by using grounded objects with higher resistance to minimize the effect of return fault current and/or using copper shields with better current-carrying capability.
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author_variant	h m t hm hmt l m a lm lma
matchkey_str	article:21929270:2017----::mcotutrltdoteaaeutiebcpesilueiaudr
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publishDate	2017
allfields	10.1007/s13632-016-0328-3 doi (DE-627)SPR03196026X (SPR)s13632-016-0328-3-e DE-627 ger DE-627 rakwb eng 670 540 530 ASE 670 540 530 ASE Tawancy, H. M. verfasserin aut A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable 2017 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as localized melting and perforation, (b) distortion and cracking of the outer protection jacket of polyvinyl chloride allowing the copper tape to come into contact with high sulfate-containing soil leading to deposition of $ CuSO_{4} $ on the copper surface, and (c) breakdown of the underlying layer of insulation shield. Most evidence suggests that overheating has been related to high return fault current exceeding the current-carrying capability of the copper tape used in the application. It is concluded that such a problem may be combated by using grounded objects with higher resistance to minimize the effect of return fault current and/or using copper shields with better current-carrying capability. Copper shield (dpeaa)DE-He213 Medium-voltage cable (dpeaa)DE-He213 Electron microscopy (dpeaa)DE-He213 Surface analysis (dpeaa)DE-He213 Alhems, Luai M. verfasserin aut Enthalten in Metallography, microstructure, and analysis New York : Springer US, 2012 6(2017), 1 vom: 04. Jan., Seite 73-81 (DE-627)68496757X (DE-600)2649490-5 2192-9270 nnns volume:6 year:2017 number:1 day:04 month:01 pages:73-81 https://dx.doi.org/10.1007/s13632-016-0328-3 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 6 2017 1 04 01 73-81
spelling	10.1007/s13632-016-0328-3 doi (DE-627)SPR03196026X (SPR)s13632-016-0328-3-e DE-627 ger DE-627 rakwb eng 670 540 530 ASE 670 540 530 ASE Tawancy, H. M. verfasserin aut A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable 2017 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as localized melting and perforation, (b) distortion and cracking of the outer protection jacket of polyvinyl chloride allowing the copper tape to come into contact with high sulfate-containing soil leading to deposition of $ CuSO_{4} $ on the copper surface, and (c) breakdown of the underlying layer of insulation shield. Most evidence suggests that overheating has been related to high return fault current exceeding the current-carrying capability of the copper tape used in the application. It is concluded that such a problem may be combated by using grounded objects with higher resistance to minimize the effect of return fault current and/or using copper shields with better current-carrying capability. Copper shield (dpeaa)DE-He213 Medium-voltage cable (dpeaa)DE-He213 Electron microscopy (dpeaa)DE-He213 Surface analysis (dpeaa)DE-He213 Alhems, Luai M. verfasserin aut Enthalten in Metallography, microstructure, and analysis New York : Springer US, 2012 6(2017), 1 vom: 04. Jan., Seite 73-81 (DE-627)68496757X (DE-600)2649490-5 2192-9270 nnns volume:6 year:2017 number:1 day:04 month:01 pages:73-81 https://dx.doi.org/10.1007/s13632-016-0328-3 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 6 2017 1 04 01 73-81
allfields_unstemmed	10.1007/s13632-016-0328-3 doi (DE-627)SPR03196026X (SPR)s13632-016-0328-3-e DE-627 ger DE-627 rakwb eng 670 540 530 ASE 670 540 530 ASE Tawancy, H. M. verfasserin aut A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable 2017 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as localized melting and perforation, (b) distortion and cracking of the outer protection jacket of polyvinyl chloride allowing the copper tape to come into contact with high sulfate-containing soil leading to deposition of $ CuSO_{4} $ on the copper surface, and (c) breakdown of the underlying layer of insulation shield. Most evidence suggests that overheating has been related to high return fault current exceeding the current-carrying capability of the copper tape used in the application. It is concluded that such a problem may be combated by using grounded objects with higher resistance to minimize the effect of return fault current and/or using copper shields with better current-carrying capability. Copper shield (dpeaa)DE-He213 Medium-voltage cable (dpeaa)DE-He213 Electron microscopy (dpeaa)DE-He213 Surface analysis (dpeaa)DE-He213 Alhems, Luai M. verfasserin aut Enthalten in Metallography, microstructure, and analysis New York : Springer US, 2012 6(2017), 1 vom: 04. Jan., Seite 73-81 (DE-627)68496757X (DE-600)2649490-5 2192-9270 nnns volume:6 year:2017 number:1 day:04 month:01 pages:73-81 https://dx.doi.org/10.1007/s13632-016-0328-3 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 6 2017 1 04 01 73-81
allfieldsGer	10.1007/s13632-016-0328-3 doi (DE-627)SPR03196026X (SPR)s13632-016-0328-3-e DE-627 ger DE-627 rakwb eng 670 540 530 ASE 670 540 530 ASE Tawancy, H. M. verfasserin aut A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable 2017 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as localized melting and perforation, (b) distortion and cracking of the outer protection jacket of polyvinyl chloride allowing the copper tape to come into contact with high sulfate-containing soil leading to deposition of $ CuSO_{4} $ on the copper surface, and (c) breakdown of the underlying layer of insulation shield. Most evidence suggests that overheating has been related to high return fault current exceeding the current-carrying capability of the copper tape used in the application. It is concluded that such a problem may be combated by using grounded objects with higher resistance to minimize the effect of return fault current and/or using copper shields with better current-carrying capability. Copper shield (dpeaa)DE-He213 Medium-voltage cable (dpeaa)DE-He213 Electron microscopy (dpeaa)DE-He213 Surface analysis (dpeaa)DE-He213 Alhems, Luai M. verfasserin aut Enthalten in Metallography, microstructure, and analysis New York : Springer US, 2012 6(2017), 1 vom: 04. Jan., Seite 73-81 (DE-627)68496757X (DE-600)2649490-5 2192-9270 nnns volume:6 year:2017 number:1 day:04 month:01 pages:73-81 https://dx.doi.org/10.1007/s13632-016-0328-3 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 6 2017 1 04 01 73-81
allfieldsSound	10.1007/s13632-016-0328-3 doi (DE-627)SPR03196026X (SPR)s13632-016-0328-3-e DE-627 ger DE-627 rakwb eng 670 540 530 ASE 670 540 530 ASE Tawancy, H. M. verfasserin aut A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable 2017 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as localized melting and perforation, (b) distortion and cracking of the outer protection jacket of polyvinyl chloride allowing the copper tape to come into contact with high sulfate-containing soil leading to deposition of $ CuSO_{4} $ on the copper surface, and (c) breakdown of the underlying layer of insulation shield. Most evidence suggests that overheating has been related to high return fault current exceeding the current-carrying capability of the copper tape used in the application. It is concluded that such a problem may be combated by using grounded objects with higher resistance to minimize the effect of return fault current and/or using copper shields with better current-carrying capability. Copper shield (dpeaa)DE-He213 Medium-voltage cable (dpeaa)DE-He213 Electron microscopy (dpeaa)DE-He213 Surface analysis (dpeaa)DE-He213 Alhems, Luai M. verfasserin aut Enthalten in Metallography, microstructure, and analysis New York : Springer US, 2012 6(2017), 1 vom: 04. Jan., Seite 73-81 (DE-627)68496757X (DE-600)2649490-5 2192-9270 nnns volume:6 year:2017 number:1 day:04 month:01 pages:73-81 https://dx.doi.org/10.1007/s13632-016-0328-3 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OLC-PHA GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 6 2017 1 04 01 73-81
language	English
source	Enthalten in Metallography, microstructure, and analysis 6(2017), 1 vom: 04. Jan., Seite 73-81 volume:6 year:2017 number:1 day:04 month:01 pages:73-81
sourceStr	Enthalten in Metallography, microstructure, and analysis 6(2017), 1 vom: 04. Jan., Seite 73-81 volume:6 year:2017 number:1 day:04 month:01 pages:73-81
format_phy_str_mv	Article
institution	findex.gbv.de
topic_facet	Copper shield Medium-voltage cable Electron microscopy Surface analysis
dewey-raw	670
isfreeaccess_bool	false
container_title	Metallography, microstructure, and analysis
authorswithroles_txt_mv	Tawancy, H. M. @@aut@@ Alhems, Luai M. @@aut@@
publishDateDaySort_date	2017-01-04T00:00:00Z
hierarchy_top_id	68496757X
dewey-sort	3670
id	SPR03196026X
language_de	englisch
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author	Tawancy, H. M.
spellingShingle	Tawancy, H. M. ddc 670 misc Copper shield misc Medium-voltage cable misc Electron microscopy misc Surface analysis A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable
authorStr	Tawancy, H. M.
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topic_title	670 540 530 ASE A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable Copper shield (dpeaa)DE-He213 Medium-voltage cable (dpeaa)DE-He213 Electron microscopy (dpeaa)DE-He213 Surface analysis (dpeaa)DE-He213
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title	A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable
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title_full	A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable
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title_sort	microstructural study of the damage sustained by copper shield used in an underground medium-voltage cable
title_auth	A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable
abstract	Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as localized melting and perforation, (b) distortion and cracking of the outer protection jacket of polyvinyl chloride allowing the copper tape to come into contact with high sulfate-containing soil leading to deposition of $ CuSO_{4} $ on the copper surface, and (c) breakdown of the underlying layer of insulation shield. Most evidence suggests that overheating has been related to high return fault current exceeding the current-carrying capability of the copper tape used in the application. It is concluded that such a problem may be combated by using grounded objects with higher resistance to minimize the effect of return fault current and/or using copper shields with better current-carrying capability.
abstractGer	Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as localized melting and perforation, (b) distortion and cracking of the outer protection jacket of polyvinyl chloride allowing the copper tape to come into contact with high sulfate-containing soil leading to deposition of $ CuSO_{4} $ on the copper surface, and (c) breakdown of the underlying layer of insulation shield. Most evidence suggests that overheating has been related to high return fault current exceeding the current-carrying capability of the copper tape used in the application. It is concluded that such a problem may be combated by using grounded objects with higher resistance to minimize the effect of return fault current and/or using copper shields with better current-carrying capability.
abstract_unstemmed	Abstract We show that a 3-mm-thick copper tape acting as metallic shield in an underground medium-voltage cable has been prematurely damaged by overheating. Detailed microstructural characterization has shown that the damage is characterized by: (a) formation of CuO on the copper surface as well as localized melting and perforation, (b) distortion and cracking of the outer protection jacket of polyvinyl chloride allowing the copper tape to come into contact with high sulfate-containing soil leading to deposition of $ CuSO_{4} $ on the copper surface, and (c) breakdown of the underlying layer of insulation shield. Most evidence suggests that overheating has been related to high return fault current exceeding the current-carrying capability of the copper tape used in the application. It is concluded that such a problem may be combated by using grounded objects with higher resistance to minimize the effect of return fault current and/or using copper shields with better current-carrying capability.
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container_issue	1
title_short	A Microstructural Study of the Damage Sustained by Copper Shield Used in an Underground Medium-Voltage Cable
url	https://dx.doi.org/10.1007/s13632-016-0328-3
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author2	Alhems, Luai M.
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doi_str	10.1007/s13632-016-0328-3
up_date	2024-07-04T01:59:09.926Z
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