Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol

Abstract Carbon nanotubes (CNTs) are some of the most valuable materials with high thermal conductivity. The thermal conductivity of individual multiwalled carbon nanotubes (MWCNTs) grown by using chemical vapor deposition is 600 ± 100 $ Wm^{−1} %$ K^{−1} $ compared with the thermal conductivity 419...
Ausführliche Beschreibung

Gespeichert in:

Autor*in:	Thang, Bui Hung [verfasserIn] Van Trinh, Pham [verfasserIn] Quang, Le Dinh [verfasserIn] Huong, Nguyen Thi [verfasserIn] Khoi, Phan Hong [verfasserIn] Minh, Phan Ngoc [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2014

Schlagwörter:	Carbon nanotubes Ethylene glycol Coolant Nanofluid Heat dissipation Intel Core i5 processor

Übergeordnetes Werk:	Enthalten in: Journal of the Korean Physical Society - Berlin : Springer, 1968, 65(2014), 3 vom: Aug., Seite 312-316
Übergeordnetes Werk:	volume:65 ; year:2014 ; number:3 ; month:08 ; pages:312-316

Links:	Volltext

DOI / URN:	10.3938/jkps.65.312

Katalog-ID:	SPR03271341X

Internformat


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520			\|a Abstract Carbon nanotubes (CNTs) are some of the most valuable materials with high thermal conductivity. The thermal conductivity of individual multiwalled carbon nanotubes (MWCNTs) grown by using chemical vapor deposition is 600 ± 100 $ Wm^{−1} %$ K^{−1} $ compared with the thermal conductivity 419 $ Wm^{−1} %$ K^{−1} $ of Ag. Carbon-nanotube-based liquids — a new class of nanomaterials, have shown many interesting properties and distinctive features offering potential in heat dissipation applications for electronic devices, such as computer microprocessor, high power LED, etc. In this work, a multiwalled carbon-nanotube-based liquid was made of well-dispersed hydroxyl-functional multiwalled carbon nanotubes (MWCNT-OH) in ethylene glycol (EG)/distilled water (DW) solutions by using Tween-80 surfactant and an ultrasonication method. The concentration of MWCNT-OH in EG/DW solutions ranged from 0.1 to 1.2 gram/liter. The dispersion of the MWCNT-OH-based EG/DW solutions was evaluated by using a Zeta-Sizer analyzer. The MWCNT-OH-based EG/DW solutions were used as coolants in the liquid cooling system for the Intel Core i5 processor. The thermal dissipation efficiency and the thermal response of the system were evaluated by directly measuring the temperature of the micro-processor using the Core Temp software and the temperature sensors built inside the micro-processor. The results confirmed the advantages of CNTs in thermal dissipation systems for computer processors and other high-power electronic devices.
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650		4	\|a Ethylene glycol \|7 (dpeaa)DE-He213
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650		4	\|a Nanofluid \|7 (dpeaa)DE-He213
650		4	\|a Heat dissipation \|7 (dpeaa)DE-He213
650		4	\|a Intel Core i5 processor \|7 (dpeaa)DE-He213
700	1		\|a Van Trinh, Pham \|e verfasserin \|4 aut
700	1		\|a Quang, Le Dinh \|e verfasserin \|4 aut
700	1		\|a Huong, Nguyen Thi \|e verfasserin \|4 aut
700	1		\|a Khoi, Phan Hong \|e verfasserin \|4 aut
700	1		\|a Minh, Phan Ngoc \|e verfasserin \|4 aut
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912			\|a GBV_ILN_2059
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912			\|a GBV_ILN_2065
912			\|a GBV_ILN_2068
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Indexfelder

author_variant	b h t bh bht t p v tp tpv l d q ld ldq n t h nt nth p h k ph phk p n m pn pnm
matchkey_str	article:19768524:2014----::etisptofrhitloe5rcsouigutwlecronn
hierarchy_sort_str	2014
bklnumber	33.00
publishDate	2014
allfields	10.3938/jkps.65.312 doi (DE-627)SPR03271341X (SPR)jkps.65.312-e DE-627 ger DE-627 rakwb eng 530 ASE 33.00 bkl Thang, Bui Hung verfasserin aut Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Carbon nanotubes (CNTs) are some of the most valuable materials with high thermal conductivity. The thermal conductivity of individual multiwalled carbon nanotubes (MWCNTs) grown by using chemical vapor deposition is 600 ± 100 $ Wm^{−1} %$ K^{−1} $ compared with the thermal conductivity 419 $ Wm^{−1} %$ K^{−1} $ of Ag. Carbon-nanotube-based liquids — a new class of nanomaterials, have shown many interesting properties and distinctive features offering potential in heat dissipation applications for electronic devices, such as computer microprocessor, high power LED, etc. In this work, a multiwalled carbon-nanotube-based liquid was made of well-dispersed hydroxyl-functional multiwalled carbon nanotubes (MWCNT-OH) in ethylene glycol (EG)/distilled water (DW) solutions by using Tween-80 surfactant and an ultrasonication method. The concentration of MWCNT-OH in EG/DW solutions ranged from 0.1 to 1.2 gram/liter. The dispersion of the MWCNT-OH-based EG/DW solutions was evaluated by using a Zeta-Sizer analyzer. The MWCNT-OH-based EG/DW solutions were used as coolants in the liquid cooling system for the Intel Core i5 processor. The thermal dissipation efficiency and the thermal response of the system were evaluated by directly measuring the temperature of the micro-processor using the Core Temp software and the temperature sensors built inside the micro-processor. The results confirmed the advantages of CNTs in thermal dissipation systems for computer processors and other high-power electronic devices. Carbon nanotubes (dpeaa)DE-He213 Ethylene glycol (dpeaa)DE-He213 Coolant (dpeaa)DE-He213 Nanofluid (dpeaa)DE-He213 Heat dissipation (dpeaa)DE-He213 Intel Core i5 processor (dpeaa)DE-He213 Van Trinh, Pham verfasserin aut Quang, Le Dinh verfasserin aut Huong, Nguyen Thi verfasserin aut Khoi, Phan Hong verfasserin aut Minh, Phan Ngoc verfasserin aut Enthalten in Journal of the Korean Physical Society Berlin : Springer, 1968 65(2014), 3 vom: Aug., Seite 312-316 (DE-627)328820865 (DE-600)2046361-3 1976-8524 nnns volume:65 year:2014 number:3 month:08 pages:312-316 https://dx.doi.org/10.3938/jkps.65.312 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 33.00 ASE AR 65 2014 3 08 312-316
spelling	10.3938/jkps.65.312 doi (DE-627)SPR03271341X (SPR)jkps.65.312-e DE-627 ger DE-627 rakwb eng 530 ASE 33.00 bkl Thang, Bui Hung verfasserin aut Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Carbon nanotubes (CNTs) are some of the most valuable materials with high thermal conductivity. The thermal conductivity of individual multiwalled carbon nanotubes (MWCNTs) grown by using chemical vapor deposition is 600 ± 100 $ Wm^{−1} %$ K^{−1} $ compared with the thermal conductivity 419 $ Wm^{−1} %$ K^{−1} $ of Ag. Carbon-nanotube-based liquids — a new class of nanomaterials, have shown many interesting properties and distinctive features offering potential in heat dissipation applications for electronic devices, such as computer microprocessor, high power LED, etc. In this work, a multiwalled carbon-nanotube-based liquid was made of well-dispersed hydroxyl-functional multiwalled carbon nanotubes (MWCNT-OH) in ethylene glycol (EG)/distilled water (DW) solutions by using Tween-80 surfactant and an ultrasonication method. The concentration of MWCNT-OH in EG/DW solutions ranged from 0.1 to 1.2 gram/liter. The dispersion of the MWCNT-OH-based EG/DW solutions was evaluated by using a Zeta-Sizer analyzer. The MWCNT-OH-based EG/DW solutions were used as coolants in the liquid cooling system for the Intel Core i5 processor. The thermal dissipation efficiency and the thermal response of the system were evaluated by directly measuring the temperature of the micro-processor using the Core Temp software and the temperature sensors built inside the micro-processor. The results confirmed the advantages of CNTs in thermal dissipation systems for computer processors and other high-power electronic devices. Carbon nanotubes (dpeaa)DE-He213 Ethylene glycol (dpeaa)DE-He213 Coolant (dpeaa)DE-He213 Nanofluid (dpeaa)DE-He213 Heat dissipation (dpeaa)DE-He213 Intel Core i5 processor (dpeaa)DE-He213 Van Trinh, Pham verfasserin aut Quang, Le Dinh verfasserin aut Huong, Nguyen Thi verfasserin aut Khoi, Phan Hong verfasserin aut Minh, Phan Ngoc verfasserin aut Enthalten in Journal of the Korean Physical Society Berlin : Springer, 1968 65(2014), 3 vom: Aug., Seite 312-316 (DE-627)328820865 (DE-600)2046361-3 1976-8524 nnns volume:65 year:2014 number:3 month:08 pages:312-316 https://dx.doi.org/10.3938/jkps.65.312 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 33.00 ASE AR 65 2014 3 08 312-316
allfields_unstemmed	10.3938/jkps.65.312 doi (DE-627)SPR03271341X (SPR)jkps.65.312-e DE-627 ger DE-627 rakwb eng 530 ASE 33.00 bkl Thang, Bui Hung verfasserin aut Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Carbon nanotubes (CNTs) are some of the most valuable materials with high thermal conductivity. The thermal conductivity of individual multiwalled carbon nanotubes (MWCNTs) grown by using chemical vapor deposition is 600 ± 100 $ Wm^{−1} %$ K^{−1} $ compared with the thermal conductivity 419 $ Wm^{−1} %$ K^{−1} $ of Ag. Carbon-nanotube-based liquids — a new class of nanomaterials, have shown many interesting properties and distinctive features offering potential in heat dissipation applications for electronic devices, such as computer microprocessor, high power LED, etc. In this work, a multiwalled carbon-nanotube-based liquid was made of well-dispersed hydroxyl-functional multiwalled carbon nanotubes (MWCNT-OH) in ethylene glycol (EG)/distilled water (DW) solutions by using Tween-80 surfactant and an ultrasonication method. The concentration of MWCNT-OH in EG/DW solutions ranged from 0.1 to 1.2 gram/liter. The dispersion of the MWCNT-OH-based EG/DW solutions was evaluated by using a Zeta-Sizer analyzer. The MWCNT-OH-based EG/DW solutions were used as coolants in the liquid cooling system for the Intel Core i5 processor. The thermal dissipation efficiency and the thermal response of the system were evaluated by directly measuring the temperature of the micro-processor using the Core Temp software and the temperature sensors built inside the micro-processor. The results confirmed the advantages of CNTs in thermal dissipation systems for computer processors and other high-power electronic devices. Carbon nanotubes (dpeaa)DE-He213 Ethylene glycol (dpeaa)DE-He213 Coolant (dpeaa)DE-He213 Nanofluid (dpeaa)DE-He213 Heat dissipation (dpeaa)DE-He213 Intel Core i5 processor (dpeaa)DE-He213 Van Trinh, Pham verfasserin aut Quang, Le Dinh verfasserin aut Huong, Nguyen Thi verfasserin aut Khoi, Phan Hong verfasserin aut Minh, Phan Ngoc verfasserin aut Enthalten in Journal of the Korean Physical Society Berlin : Springer, 1968 65(2014), 3 vom: Aug., Seite 312-316 (DE-627)328820865 (DE-600)2046361-3 1976-8524 nnns volume:65 year:2014 number:3 month:08 pages:312-316 https://dx.doi.org/10.3938/jkps.65.312 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 33.00 ASE AR 65 2014 3 08 312-316
allfieldsGer	10.3938/jkps.65.312 doi (DE-627)SPR03271341X (SPR)jkps.65.312-e DE-627 ger DE-627 rakwb eng 530 ASE 33.00 bkl Thang, Bui Hung verfasserin aut Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Carbon nanotubes (CNTs) are some of the most valuable materials with high thermal conductivity. The thermal conductivity of individual multiwalled carbon nanotubes (MWCNTs) grown by using chemical vapor deposition is 600 ± 100 $ Wm^{−1} %$ K^{−1} $ compared with the thermal conductivity 419 $ Wm^{−1} %$ K^{−1} $ of Ag. Carbon-nanotube-based liquids — a new class of nanomaterials, have shown many interesting properties and distinctive features offering potential in heat dissipation applications for electronic devices, such as computer microprocessor, high power LED, etc. In this work, a multiwalled carbon-nanotube-based liquid was made of well-dispersed hydroxyl-functional multiwalled carbon nanotubes (MWCNT-OH) in ethylene glycol (EG)/distilled water (DW) solutions by using Tween-80 surfactant and an ultrasonication method. The concentration of MWCNT-OH in EG/DW solutions ranged from 0.1 to 1.2 gram/liter. The dispersion of the MWCNT-OH-based EG/DW solutions was evaluated by using a Zeta-Sizer analyzer. The MWCNT-OH-based EG/DW solutions were used as coolants in the liquid cooling system for the Intel Core i5 processor. The thermal dissipation efficiency and the thermal response of the system were evaluated by directly measuring the temperature of the micro-processor using the Core Temp software and the temperature sensors built inside the micro-processor. The results confirmed the advantages of CNTs in thermal dissipation systems for computer processors and other high-power electronic devices. Carbon nanotubes (dpeaa)DE-He213 Ethylene glycol (dpeaa)DE-He213 Coolant (dpeaa)DE-He213 Nanofluid (dpeaa)DE-He213 Heat dissipation (dpeaa)DE-He213 Intel Core i5 processor (dpeaa)DE-He213 Van Trinh, Pham verfasserin aut Quang, Le Dinh verfasserin aut Huong, Nguyen Thi verfasserin aut Khoi, Phan Hong verfasserin aut Minh, Phan Ngoc verfasserin aut Enthalten in Journal of the Korean Physical Society Berlin : Springer, 1968 65(2014), 3 vom: Aug., Seite 312-316 (DE-627)328820865 (DE-600)2046361-3 1976-8524 nnns volume:65 year:2014 number:3 month:08 pages:312-316 https://dx.doi.org/10.3938/jkps.65.312 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 33.00 ASE AR 65 2014 3 08 312-316
allfieldsSound	10.3938/jkps.65.312 doi (DE-627)SPR03271341X (SPR)jkps.65.312-e DE-627 ger DE-627 rakwb eng 530 ASE 33.00 bkl Thang, Bui Hung verfasserin aut Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Carbon nanotubes (CNTs) are some of the most valuable materials with high thermal conductivity. The thermal conductivity of individual multiwalled carbon nanotubes (MWCNTs) grown by using chemical vapor deposition is 600 ± 100 $ Wm^{−1} %$ K^{−1} $ compared with the thermal conductivity 419 $ Wm^{−1} %$ K^{−1} $ of Ag. Carbon-nanotube-based liquids — a new class of nanomaterials, have shown many interesting properties and distinctive features offering potential in heat dissipation applications for electronic devices, such as computer microprocessor, high power LED, etc. In this work, a multiwalled carbon-nanotube-based liquid was made of well-dispersed hydroxyl-functional multiwalled carbon nanotubes (MWCNT-OH) in ethylene glycol (EG)/distilled water (DW) solutions by using Tween-80 surfactant and an ultrasonication method. The concentration of MWCNT-OH in EG/DW solutions ranged from 0.1 to 1.2 gram/liter. The dispersion of the MWCNT-OH-based EG/DW solutions was evaluated by using a Zeta-Sizer analyzer. The MWCNT-OH-based EG/DW solutions were used as coolants in the liquid cooling system for the Intel Core i5 processor. The thermal dissipation efficiency and the thermal response of the system were evaluated by directly measuring the temperature of the micro-processor using the Core Temp software and the temperature sensors built inside the micro-processor. The results confirmed the advantages of CNTs in thermal dissipation systems for computer processors and other high-power electronic devices. Carbon nanotubes (dpeaa)DE-He213 Ethylene glycol (dpeaa)DE-He213 Coolant (dpeaa)DE-He213 Nanofluid (dpeaa)DE-He213 Heat dissipation (dpeaa)DE-He213 Intel Core i5 processor (dpeaa)DE-He213 Van Trinh, Pham verfasserin aut Quang, Le Dinh verfasserin aut Huong, Nguyen Thi verfasserin aut Khoi, Phan Hong verfasserin aut Minh, Phan Ngoc verfasserin aut Enthalten in Journal of the Korean Physical Society Berlin : Springer, 1968 65(2014), 3 vom: Aug., Seite 312-316 (DE-627)328820865 (DE-600)2046361-3 1976-8524 nnns volume:65 year:2014 number:3 month:08 pages:312-316 https://dx.doi.org/10.3938/jkps.65.312 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 33.00 ASE AR 65 2014 3 08 312-316
language	English
source	Enthalten in Journal of the Korean Physical Society 65(2014), 3 vom: Aug., Seite 312-316 volume:65 year:2014 number:3 month:08 pages:312-316
sourceStr	Enthalten in Journal of the Korean Physical Society 65(2014), 3 vom: Aug., Seite 312-316 volume:65 year:2014 number:3 month:08 pages:312-316
format_phy_str_mv	Article
institution	findex.gbv.de
topic_facet	Carbon nanotubes Ethylene glycol Coolant Nanofluid Heat dissipation Intel Core i5 processor
dewey-raw	530
isfreeaccess_bool	false
container_title	Journal of the Korean Physical Society
authorswithroles_txt_mv	Thang, Bui Hung @@aut@@ Van Trinh, Pham @@aut@@ Quang, Le Dinh @@aut@@ Huong, Nguyen Thi @@aut@@ Khoi, Phan Hong @@aut@@ Minh, Phan Ngoc @@aut@@
publishDateDaySort_date	2014-08-01T00:00:00Z
hierarchy_top_id	328820865
dewey-sort	3530
id	SPR03271341X
language_de	englisch
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author	Thang, Bui Hung
spellingShingle	Thang, Bui Hung ddc 530 bkl 33.00 misc Carbon nanotubes misc Ethylene glycol misc Coolant misc Nanofluid misc Heat dissipation misc Intel Core i5 processor Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol
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topic_title	530 ASE 33.00 bkl Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol Carbon nanotubes (dpeaa)DE-He213 Ethylene glycol (dpeaa)DE-He213 Coolant (dpeaa)DE-He213 Nanofluid (dpeaa)DE-He213 Heat dissipation (dpeaa)DE-He213 Intel Core i5 processor (dpeaa)DE-He213
topic	ddc 530 bkl 33.00 misc Carbon nanotubes misc Ethylene glycol misc Coolant misc Nanofluid misc Heat dissipation misc Intel Core i5 processor
topic_unstemmed	ddc 530 bkl 33.00 misc Carbon nanotubes misc Ethylene glycol misc Coolant misc Nanofluid misc Heat dissipation misc Intel Core i5 processor
topic_browse	ddc 530 bkl 33.00 misc Carbon nanotubes misc Ethylene glycol misc Coolant misc Nanofluid misc Heat dissipation misc Intel Core i5 processor
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title	Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol
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title_full	Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol
author_sort	Thang, Bui Hung
journal	Journal of the Korean Physical Society
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title_sort	heat dissipation for the intel core i5 processor using multiwalled carbon-nanotube-based ethylene glycol
title_auth	Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol
abstract	Abstract Carbon nanotubes (CNTs) are some of the most valuable materials with high thermal conductivity. The thermal conductivity of individual multiwalled carbon nanotubes (MWCNTs) grown by using chemical vapor deposition is 600 ± 100 $ Wm^{−1} %$ K^{−1} $ compared with the thermal conductivity 419 $ Wm^{−1} %$ K^{−1} $ of Ag. Carbon-nanotube-based liquids — a new class of nanomaterials, have shown many interesting properties and distinctive features offering potential in heat dissipation applications for electronic devices, such as computer microprocessor, high power LED, etc. In this work, a multiwalled carbon-nanotube-based liquid was made of well-dispersed hydroxyl-functional multiwalled carbon nanotubes (MWCNT-OH) in ethylene glycol (EG)/distilled water (DW) solutions by using Tween-80 surfactant and an ultrasonication method. The concentration of MWCNT-OH in EG/DW solutions ranged from 0.1 to 1.2 gram/liter. The dispersion of the MWCNT-OH-based EG/DW solutions was evaluated by using a Zeta-Sizer analyzer. The MWCNT-OH-based EG/DW solutions were used as coolants in the liquid cooling system for the Intel Core i5 processor. The thermal dissipation efficiency and the thermal response of the system were evaluated by directly measuring the temperature of the micro-processor using the Core Temp software and the temperature sensors built inside the micro-processor. The results confirmed the advantages of CNTs in thermal dissipation systems for computer processors and other high-power electronic devices.
abstractGer	Abstract Carbon nanotubes (CNTs) are some of the most valuable materials with high thermal conductivity. The thermal conductivity of individual multiwalled carbon nanotubes (MWCNTs) grown by using chemical vapor deposition is 600 ± 100 $ Wm^{−1} %$ K^{−1} $ compared with the thermal conductivity 419 $ Wm^{−1} %$ K^{−1} $ of Ag. Carbon-nanotube-based liquids — a new class of nanomaterials, have shown many interesting properties and distinctive features offering potential in heat dissipation applications for electronic devices, such as computer microprocessor, high power LED, etc. In this work, a multiwalled carbon-nanotube-based liquid was made of well-dispersed hydroxyl-functional multiwalled carbon nanotubes (MWCNT-OH) in ethylene glycol (EG)/distilled water (DW) solutions by using Tween-80 surfactant and an ultrasonication method. The concentration of MWCNT-OH in EG/DW solutions ranged from 0.1 to 1.2 gram/liter. The dispersion of the MWCNT-OH-based EG/DW solutions was evaluated by using a Zeta-Sizer analyzer. The MWCNT-OH-based EG/DW solutions were used as coolants in the liquid cooling system for the Intel Core i5 processor. The thermal dissipation efficiency and the thermal response of the system were evaluated by directly measuring the temperature of the micro-processor using the Core Temp software and the temperature sensors built inside the micro-processor. The results confirmed the advantages of CNTs in thermal dissipation systems for computer processors and other high-power electronic devices.
abstract_unstemmed	Abstract Carbon nanotubes (CNTs) are some of the most valuable materials with high thermal conductivity. The thermal conductivity of individual multiwalled carbon nanotubes (MWCNTs) grown by using chemical vapor deposition is 600 ± 100 $ Wm^{−1} %$ K^{−1} $ compared with the thermal conductivity 419 $ Wm^{−1} %$ K^{−1} $ of Ag. Carbon-nanotube-based liquids — a new class of nanomaterials, have shown many interesting properties and distinctive features offering potential in heat dissipation applications for electronic devices, such as computer microprocessor, high power LED, etc. In this work, a multiwalled carbon-nanotube-based liquid was made of well-dispersed hydroxyl-functional multiwalled carbon nanotubes (MWCNT-OH) in ethylene glycol (EG)/distilled water (DW) solutions by using Tween-80 surfactant and an ultrasonication method. The concentration of MWCNT-OH in EG/DW solutions ranged from 0.1 to 1.2 gram/liter. The dispersion of the MWCNT-OH-based EG/DW solutions was evaluated by using a Zeta-Sizer analyzer. The MWCNT-OH-based EG/DW solutions were used as coolants in the liquid cooling system for the Intel Core i5 processor. The thermal dissipation efficiency and the thermal response of the system were evaluated by directly measuring the temperature of the micro-processor using the Core Temp software and the temperature sensors built inside the micro-processor. The results confirmed the advantages of CNTs in thermal dissipation systems for computer processors and other high-power electronic devices.
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container_issue	3
title_short	Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol
url	https://dx.doi.org/10.3938/jkps.65.312
remote_bool	true
author2	Van Trinh, Pham Quang, Le Dinh Huong, Nguyen Thi Khoi, Phan Hong Minh, Phan Ngoc
author2Str	Van Trinh, Pham Quang, Le Dinh Huong, Nguyen Thi Khoi, Phan Hong Minh, Phan Ngoc
ppnlink	328820865
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isOA_txt	false
hochschulschrift_bool	false
doi_str	10.3938/jkps.65.312
up_date	2024-07-03T14:21:10.185Z
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Heat dissipation for the Intel Core i5 processor using multiwalled carbon-nanotube-based ethylene glycol

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