Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints
Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Seo, Sun-Kyoung [verfasserIn] Cho, Moon Gi [verfasserIn] Lee, Hyuck Mo [verfasserIn] |
|---|
| Format: |
E-Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2010 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of materials research - Berlin : Springer, 1986, 25(2010), 10 vom: Okt., Seite 1950-1957 |
|---|---|
| Übergeordnetes Werk: |
volume:25 ; year:2010 ; number:10 ; month:10 ; pages:1950-1957 |
| Links: |
|---|
| DOI / URN: |
10.1557/JMR.2010.0253 |
|---|
| Katalog-ID: |
SPR04290451X |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | SPR04290451X | ||
| 003 | DE-627 | ||
| 005 | 20220112054545.0 | ||
| 007 | cr uuu---uuuuu | ||
| 008 | 210129s2010 xx |||||o 00| ||eng c | ||
| 024 | 7 | |a 10.1557/JMR.2010.0253 |2 doi | |
| 035 | |a (DE-627)SPR04290451X | ||
| 035 | |a (DE-599)SPRJMR.2010.0253-e | ||
| 035 | |a (SPR)JMR.2010.0253-e | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | 4 | |a 670 |q ASE |
| 084 | |a 51.00 |2 bkl | ||
| 100 | 1 | |a Seo, Sun-Kyoung |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints |
| 264 | 1 | |c 2010 | |
| 336 | |a Text |b txt |2 rdacontent | ||
| 337 | |a Computermedien |b c |2 rdamedia | ||
| 338 | |a Online-Ressource |b cr |2 rdacarrier | ||
| 520 | |a Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint. | ||
| 700 | 1 | |a Cho, Moon Gi |e verfasserin |4 aut | |
| 700 | 1 | |a Lee, Hyuck Mo |e verfasserin |4 aut | |
| 773 | 0 | 8 | |i Enthalten in |t Journal of materials research |d Berlin : Springer, 1986 |g 25(2010), 10 vom: Okt., Seite 1950-1957 |w (DE-627)320527026 |w (DE-600)2015297-8 |x 2044-5326 |7 nnns |
| 773 | 1 | 8 | |g volume:25 |g year:2010 |g number:10 |g month:10 |g pages:1950-1957 |
| 856 | 4 | 0 | |u https://dx.doi.org/10.1557/JMR.2010.0253 |z lizenzpflichtig |3 Volltext |
| 912 | |a GBV_USEFLAG_A | ||
| 912 | |a SYSFLAG_A | ||
| 912 | |a GBV_SPRINGER | ||
| 912 | |a GBV_ILN_23 | ||
| 912 | |a GBV_ILN_24 | ||
| 912 | |a GBV_ILN_31 | ||
| 912 | |a GBV_ILN_70 | ||
| 912 | |a GBV_ILN_120 | ||
| 912 | |a GBV_ILN_293 | ||
| 912 | |a GBV_ILN_374 | ||
| 912 | |a GBV_ILN_702 | ||
| 912 | |a GBV_ILN_2005 | ||
| 912 | |a GBV_ILN_2020 | ||
| 912 | |a GBV_ILN_2190 | ||
| 912 | |a GBV_ILN_2336 | ||
| 912 | |a GBV_ILN_4126 | ||
| 936 | b | k | |a 51.00 |q ASE |
| 951 | |a AR | ||
| 952 | |d 25 |j 2010 |e 10 |c 10 |h 1950-1957 | ||
| author_variant |
s k s sks m g c mg mgc h m l hm hml |
|---|---|
| matchkey_str |
article:20445326:2010----::rsaoinainfnriinpn5uunn |
| hierarchy_sort_str |
2010 |
| bklnumber |
51.00 |
| publishDate |
2010 |
| allfields |
10.1557/JMR.2010.0253 doi (DE-627)SPR04290451X (DE-599)SPRJMR.2010.0253-e (SPR)JMR.2010.0253-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Seo, Sun-Kyoung verfasserin aut Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints 2010 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint. Cho, Moon Gi verfasserin aut Lee, Hyuck Mo verfasserin aut Enthalten in Journal of materials research Berlin : Springer, 1986 25(2010), 10 vom: Okt., Seite 1950-1957 (DE-627)320527026 (DE-600)2015297-8 2044-5326 nnns volume:25 year:2010 number:10 month:10 pages:1950-1957 https://dx.doi.org/10.1557/JMR.2010.0253 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_70 GBV_ILN_120 GBV_ILN_293 GBV_ILN_374 GBV_ILN_702 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_4126 51.00 ASE AR 25 2010 10 10 1950-1957 |
| spelling |
10.1557/JMR.2010.0253 doi (DE-627)SPR04290451X (DE-599)SPRJMR.2010.0253-e (SPR)JMR.2010.0253-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Seo, Sun-Kyoung verfasserin aut Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints 2010 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint. Cho, Moon Gi verfasserin aut Lee, Hyuck Mo verfasserin aut Enthalten in Journal of materials research Berlin : Springer, 1986 25(2010), 10 vom: Okt., Seite 1950-1957 (DE-627)320527026 (DE-600)2015297-8 2044-5326 nnns volume:25 year:2010 number:10 month:10 pages:1950-1957 https://dx.doi.org/10.1557/JMR.2010.0253 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_70 GBV_ILN_120 GBV_ILN_293 GBV_ILN_374 GBV_ILN_702 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_4126 51.00 ASE AR 25 2010 10 10 1950-1957 |
| allfields_unstemmed |
10.1557/JMR.2010.0253 doi (DE-627)SPR04290451X (DE-599)SPRJMR.2010.0253-e (SPR)JMR.2010.0253-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Seo, Sun-Kyoung verfasserin aut Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints 2010 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint. Cho, Moon Gi verfasserin aut Lee, Hyuck Mo verfasserin aut Enthalten in Journal of materials research Berlin : Springer, 1986 25(2010), 10 vom: Okt., Seite 1950-1957 (DE-627)320527026 (DE-600)2015297-8 2044-5326 nnns volume:25 year:2010 number:10 month:10 pages:1950-1957 https://dx.doi.org/10.1557/JMR.2010.0253 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_70 GBV_ILN_120 GBV_ILN_293 GBV_ILN_374 GBV_ILN_702 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_4126 51.00 ASE AR 25 2010 10 10 1950-1957 |
| allfieldsGer |
10.1557/JMR.2010.0253 doi (DE-627)SPR04290451X (DE-599)SPRJMR.2010.0253-e (SPR)JMR.2010.0253-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Seo, Sun-Kyoung verfasserin aut Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints 2010 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint. Cho, Moon Gi verfasserin aut Lee, Hyuck Mo verfasserin aut Enthalten in Journal of materials research Berlin : Springer, 1986 25(2010), 10 vom: Okt., Seite 1950-1957 (DE-627)320527026 (DE-600)2015297-8 2044-5326 nnns volume:25 year:2010 number:10 month:10 pages:1950-1957 https://dx.doi.org/10.1557/JMR.2010.0253 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_70 GBV_ILN_120 GBV_ILN_293 GBV_ILN_374 GBV_ILN_702 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_4126 51.00 ASE AR 25 2010 10 10 1950-1957 |
| allfieldsSound |
10.1557/JMR.2010.0253 doi (DE-627)SPR04290451X (DE-599)SPRJMR.2010.0253-e (SPR)JMR.2010.0253-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Seo, Sun-Kyoung verfasserin aut Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints 2010 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint. Cho, Moon Gi verfasserin aut Lee, Hyuck Mo verfasserin aut Enthalten in Journal of materials research Berlin : Springer, 1986 25(2010), 10 vom: Okt., Seite 1950-1957 (DE-627)320527026 (DE-600)2015297-8 2044-5326 nnns volume:25 year:2010 number:10 month:10 pages:1950-1957 https://dx.doi.org/10.1557/JMR.2010.0253 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_70 GBV_ILN_120 GBV_ILN_293 GBV_ILN_374 GBV_ILN_702 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_4126 51.00 ASE AR 25 2010 10 10 1950-1957 |
| language |
English |
| source |
Enthalten in Journal of materials research 25(2010), 10 vom: Okt., Seite 1950-1957 volume:25 year:2010 number:10 month:10 pages:1950-1957 |
| sourceStr |
Enthalten in Journal of materials research 25(2010), 10 vom: Okt., Seite 1950-1957 volume:25 year:2010 number:10 month:10 pages:1950-1957 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| dewey-raw |
670 |
| isfreeaccess_bool |
false |
| container_title |
Journal of materials research |
| authorswithroles_txt_mv |
Seo, Sun-Kyoung @@aut@@ Cho, Moon Gi @@aut@@ Lee, Hyuck Mo @@aut@@ |
| publishDateDaySort_date |
2010-10-01T00:00:00Z |
| hierarchy_top_id |
320527026 |
| dewey-sort |
3670 |
| id |
SPR04290451X |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">SPR04290451X</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20220112054545.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">210129s2010 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1557/JMR.2010.0253</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)SPR04290451X</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)SPRJMR.2010.0253-e</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(SPR)JMR.2010.0253-e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">ASE</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">51.00</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Seo, Sun-Kyoung</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2010</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Cho, Moon Gi</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lee, Hyuck Mo</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of materials research</subfield><subfield code="d">Berlin : Springer, 1986</subfield><subfield code="g">25(2010), 10 vom: Okt., Seite 1950-1957</subfield><subfield code="w">(DE-627)320527026</subfield><subfield code="w">(DE-600)2015297-8</subfield><subfield code="x">2044-5326</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:25</subfield><subfield code="g">year:2010</subfield><subfield code="g">number:10</subfield><subfield code="g">month:10</subfield><subfield code="g">pages:1950-1957</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://dx.doi.org/10.1557/JMR.2010.0253</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_SPRINGER</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_23</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_24</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_31</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_120</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_293</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_374</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_702</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2005</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2190</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2336</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4126</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">51.00</subfield><subfield code="q">ASE</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">25</subfield><subfield code="j">2010</subfield><subfield code="e">10</subfield><subfield code="c">10</subfield><subfield code="h">1950-1957</subfield></datafield></record></collection>
|
| author |
Seo, Sun-Kyoung |
| spellingShingle |
Seo, Sun-Kyoung ddc 670 bkl 51.00 Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints |
| authorStr |
Seo, Sun-Kyoung |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)320527026 |
| format |
electronic Article |
| dewey-ones |
670 - Manufacturing |
| delete_txt_mv |
keep |
| author_role |
aut aut aut |
| collection |
springer |
| remote_str |
true |
| illustrated |
Not Illustrated |
| issn |
2044-5326 |
| topic_title |
670 ASE 51.00 bkl Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints |
| topic |
ddc 670 bkl 51.00 |
| topic_unstemmed |
ddc 670 bkl 51.00 |
| topic_browse |
ddc 670 bkl 51.00 |
| format_facet |
Elektronische Aufsätze Aufsätze Elektronische Ressource |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
cr |
| hierarchy_parent_title |
Journal of materials research |
| hierarchy_parent_id |
320527026 |
| dewey-tens |
670 - Manufacturing |
| hierarchy_top_title |
Journal of materials research |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)320527026 (DE-600)2015297-8 |
| title |
Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints |
| ctrlnum |
(DE-627)SPR04290451X (DE-599)SPRJMR.2010.0253-e (SPR)JMR.2010.0253-e |
| title_full |
Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints |
| author_sort |
Seo, Sun-Kyoung |
| journal |
Journal of materials research |
| journalStr |
Journal of materials research |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
600 - Technology |
| recordtype |
marc |
| publishDateSort |
2010 |
| contenttype_str_mv |
txt |
| container_start_page |
1950 |
| author_browse |
Seo, Sun-Kyoung Cho, Moon Gi Lee, Hyuck Mo |
| container_volume |
25 |
| class |
670 ASE 51.00 bkl |
| format_se |
Elektronische Aufsätze |
| author-letter |
Seo, Sun-Kyoung |
| doi_str_mv |
10.1557/JMR.2010.0253 |
| dewey-full |
670 |
| author2-role |
verfasserin |
| title_sort |
crystal orientation of β-sn grain in ni(p)/sn-0.5cu/cu and ni(p)/sn-1.8ag/cu joints |
| title_auth |
Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints |
| abstract |
Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint. |
| abstractGer |
Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint. |
| abstract_unstemmed |
Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint. |
| collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_70 GBV_ILN_120 GBV_ILN_293 GBV_ILN_374 GBV_ILN_702 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_2190 GBV_ILN_2336 GBV_ILN_4126 |
| container_issue |
10 |
| title_short |
Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints |
| url |
https://dx.doi.org/10.1557/JMR.2010.0253 |
| remote_bool |
true |
| author2 |
Cho, Moon Gi Lee, Hyuck Mo |
| author2Str |
Cho, Moon Gi Lee, Hyuck Mo |
| ppnlink |
320527026 |
| mediatype_str_mv |
c |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| doi_str |
10.1557/JMR.2010.0253 |
| up_date |
2024-07-03T15:29:08.069Z |
| _version_ |
1803572266215145472 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">SPR04290451X</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20220112054545.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">210129s2010 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1557/JMR.2010.0253</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)SPR04290451X</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)SPRJMR.2010.0253-e</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(SPR)JMR.2010.0253-e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">ASE</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">51.00</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Seo, Sun-Kyoung</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Crystal orientation of β-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2010</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Electron backscatter diffraction analysis was used to compare the crystal orientation of β-Sn grains in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints before and after aging. In Ni(P)/solder/Cu joints, the solder composition (Cu versus Ag) significantly affects β-Sn grain orientation. In Ni(P)/Sn-0.5Cu/Cu, there are two types of small columnar grains grown from Ni(P) and Cu under bump metallurgy with a high-angle grain boundary crossing the joint closer to the Ni side; in contrast, Ni(P)/Sn-1.8Ag/Cu has large grains with low-angle boundaries. During thermal aging at 150 °C for 250 h, the Ni(P)/Sn-0.5Cu/Cu joints undergo a more significant microstructural change than the Ni(P)/Sn-1.8Ag/Cu joint. Additionally, obvious ledges developed along the high-angle grain boundary between the upper and lower areas in the Sn-0.5Cu joint.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Cho, Moon Gi</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lee, Hyuck Mo</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of materials research</subfield><subfield code="d">Berlin : Springer, 1986</subfield><subfield code="g">25(2010), 10 vom: Okt., Seite 1950-1957</subfield><subfield code="w">(DE-627)320527026</subfield><subfield code="w">(DE-600)2015297-8</subfield><subfield code="x">2044-5326</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:25</subfield><subfield code="g">year:2010</subfield><subfield code="g">number:10</subfield><subfield code="g">month:10</subfield><subfield code="g">pages:1950-1957</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://dx.doi.org/10.1557/JMR.2010.0253</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_SPRINGER</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_23</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_24</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_31</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_120</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_293</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_374</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_702</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2005</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2190</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2336</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4126</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">51.00</subfield><subfield code="q">ASE</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">25</subfield><subfield code="j">2010</subfield><subfield code="e">10</subfield><subfield code="c">10</subfield><subfield code="h">1950-1957</subfield></datafield></record></collection>
|
| score |
7.398122 |