Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties
Abstract Polymers play an integral part in the semiconductor electronic industry. Low dielectric constant materials (k < 3.0) have the advantage of facilitating manufacture of high performance integrated circuit (IC) devices with decreasing feature size of the chip. In this work, two different ap...
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Gespeichert in:
| Autor*in: |
Asrafali, Shakila Parveen [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2022 |
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| Schlagwörter: |
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| Anmerkung: |
© The Polymer Society, Taipei 2022 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of polymer research - Dordrecht : Springer Science + Business Media B.V., 1994, 29(2022), 5 vom: 21. Apr. |
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| Übergeordnetes Werk: |
volume:29 ; year:2022 ; number:5 ; day:21 ; month:04 |
| Links: |
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| DOI / URN: |
10.1007/s10965-022-03010-9 |
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| Katalog-ID: |
SPR046809600 |
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| 245 | 1 | 0 | |a Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties |
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| 520 | |a Abstract Polymers play an integral part in the semiconductor electronic industry. Low dielectric constant materials (k < 3.0) have the advantage of facilitating manufacture of high performance integrated circuit (IC) devices with decreasing feature size of the chip. In this work, two different approaches has been put forth to produce low dielectric materials from polybenzoxazines (Pbzs). At first benzoxazine (Bzo) monomers with different functionalities such as nitrile, benzophenone and azo groups in their backbone were synthesized. And secondly, Pbz/$ SiO_{2} $ nanocomposites were prepared using the synthesized monomers and $ SiO_{2} $ nanoparticles (NPs). Simple Mannich reaction and thermal curing were effective for synthesizing the ring closure and ring opening benzoxazines via molecular designs and provided high yield products without using any specific catalyst. DSC analysis showed that the benzoxazine monomers exhibit different reactivity towards polymerization as it possesses different functional groups. The inclusion of the inorganic component into the organic polymer had a significant enhancing effect on both thermal and mechanical properties of polybenzoxazine. An increase in thermal and mechanical property and a decrease in dielectric property are observed on increasing the addition of silica nanoparticles to the benzoxazine matrix. | ||
| 650 | 4 | |a Polybenzoxazine |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Silica nanoparticles |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Nanocomposites |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Low dielectric materials |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Periyasamy, Thirukumaran |4 aut | |
| 700 | 1 | |a Haldhar, Rajesh |4 aut | |
| 700 | 1 | |a Madhappan, Santhamoorthy |4 aut | |
| 700 | 1 | |a Kim, Seong-Cheol |4 aut | |
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10.1007/s10965-022-03010-9 doi (DE-627)SPR046809600 (SPR)s10965-022-03010-9-e DE-627 ger DE-627 rakwb eng Asrafali, Shakila Parveen verfasserin (orcid)0000-0002-2638-5477 aut Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties 2022 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Polymer Society, Taipei 2022 Abstract Polymers play an integral part in the semiconductor electronic industry. Low dielectric constant materials (k < 3.0) have the advantage of facilitating manufacture of high performance integrated circuit (IC) devices with decreasing feature size of the chip. In this work, two different approaches has been put forth to produce low dielectric materials from polybenzoxazines (Pbzs). At first benzoxazine (Bzo) monomers with different functionalities such as nitrile, benzophenone and azo groups in their backbone were synthesized. And secondly, Pbz/$ SiO_{2} $ nanocomposites were prepared using the synthesized monomers and $ SiO_{2} $ nanoparticles (NPs). Simple Mannich reaction and thermal curing were effective for synthesizing the ring closure and ring opening benzoxazines via molecular designs and provided high yield products without using any specific catalyst. DSC analysis showed that the benzoxazine monomers exhibit different reactivity towards polymerization as it possesses different functional groups. The inclusion of the inorganic component into the organic polymer had a significant enhancing effect on both thermal and mechanical properties of polybenzoxazine. An increase in thermal and mechanical property and a decrease in dielectric property are observed on increasing the addition of silica nanoparticles to the benzoxazine matrix. Polybenzoxazine (dpeaa)DE-He213 Silica nanoparticles (dpeaa)DE-He213 Nanocomposites (dpeaa)DE-He213 Low dielectric materials (dpeaa)DE-He213 Periyasamy, Thirukumaran aut Haldhar, Rajesh aut Madhappan, Santhamoorthy aut Kim, Seong-Cheol aut Enthalten in Journal of polymer research Dordrecht : Springer Science + Business Media B.V., 1994 29(2022), 5 vom: 21. Apr. (DE-627)340872098 (DE-600)2065616-6 1572-8935 nnns volume:29 year:2022 number:5 day:21 month:04 https://dx.doi.org/10.1007/s10965-022-03010-9 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 29 2022 5 21 04 |
| spelling |
10.1007/s10965-022-03010-9 doi (DE-627)SPR046809600 (SPR)s10965-022-03010-9-e DE-627 ger DE-627 rakwb eng Asrafali, Shakila Parveen verfasserin (orcid)0000-0002-2638-5477 aut Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties 2022 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Polymer Society, Taipei 2022 Abstract Polymers play an integral part in the semiconductor electronic industry. Low dielectric constant materials (k < 3.0) have the advantage of facilitating manufacture of high performance integrated circuit (IC) devices with decreasing feature size of the chip. In this work, two different approaches has been put forth to produce low dielectric materials from polybenzoxazines (Pbzs). At first benzoxazine (Bzo) monomers with different functionalities such as nitrile, benzophenone and azo groups in their backbone were synthesized. And secondly, Pbz/$ SiO_{2} $ nanocomposites were prepared using the synthesized monomers and $ SiO_{2} $ nanoparticles (NPs). Simple Mannich reaction and thermal curing were effective for synthesizing the ring closure and ring opening benzoxazines via molecular designs and provided high yield products without using any specific catalyst. DSC analysis showed that the benzoxazine monomers exhibit different reactivity towards polymerization as it possesses different functional groups. The inclusion of the inorganic component into the organic polymer had a significant enhancing effect on both thermal and mechanical properties of polybenzoxazine. An increase in thermal and mechanical property and a decrease in dielectric property are observed on increasing the addition of silica nanoparticles to the benzoxazine matrix. Polybenzoxazine (dpeaa)DE-He213 Silica nanoparticles (dpeaa)DE-He213 Nanocomposites (dpeaa)DE-He213 Low dielectric materials (dpeaa)DE-He213 Periyasamy, Thirukumaran aut Haldhar, Rajesh aut Madhappan, Santhamoorthy aut Kim, Seong-Cheol aut Enthalten in Journal of polymer research Dordrecht : Springer Science + Business Media B.V., 1994 29(2022), 5 vom: 21. Apr. (DE-627)340872098 (DE-600)2065616-6 1572-8935 nnns volume:29 year:2022 number:5 day:21 month:04 https://dx.doi.org/10.1007/s10965-022-03010-9 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 29 2022 5 21 04 |
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10.1007/s10965-022-03010-9 doi (DE-627)SPR046809600 (SPR)s10965-022-03010-9-e DE-627 ger DE-627 rakwb eng Asrafali, Shakila Parveen verfasserin (orcid)0000-0002-2638-5477 aut Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties 2022 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Polymer Society, Taipei 2022 Abstract Polymers play an integral part in the semiconductor electronic industry. Low dielectric constant materials (k < 3.0) have the advantage of facilitating manufacture of high performance integrated circuit (IC) devices with decreasing feature size of the chip. In this work, two different approaches has been put forth to produce low dielectric materials from polybenzoxazines (Pbzs). At first benzoxazine (Bzo) monomers with different functionalities such as nitrile, benzophenone and azo groups in their backbone were synthesized. And secondly, Pbz/$ SiO_{2} $ nanocomposites were prepared using the synthesized monomers and $ SiO_{2} $ nanoparticles (NPs). Simple Mannich reaction and thermal curing were effective for synthesizing the ring closure and ring opening benzoxazines via molecular designs and provided high yield products without using any specific catalyst. DSC analysis showed that the benzoxazine monomers exhibit different reactivity towards polymerization as it possesses different functional groups. The inclusion of the inorganic component into the organic polymer had a significant enhancing effect on both thermal and mechanical properties of polybenzoxazine. An increase in thermal and mechanical property and a decrease in dielectric property are observed on increasing the addition of silica nanoparticles to the benzoxazine matrix. Polybenzoxazine (dpeaa)DE-He213 Silica nanoparticles (dpeaa)DE-He213 Nanocomposites (dpeaa)DE-He213 Low dielectric materials (dpeaa)DE-He213 Periyasamy, Thirukumaran aut Haldhar, Rajesh aut Madhappan, Santhamoorthy aut Kim, Seong-Cheol aut Enthalten in Journal of polymer research Dordrecht : Springer Science + Business Media B.V., 1994 29(2022), 5 vom: 21. Apr. (DE-627)340872098 (DE-600)2065616-6 1572-8935 nnns volume:29 year:2022 number:5 day:21 month:04 https://dx.doi.org/10.1007/s10965-022-03010-9 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 29 2022 5 21 04 |
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10.1007/s10965-022-03010-9 doi (DE-627)SPR046809600 (SPR)s10965-022-03010-9-e DE-627 ger DE-627 rakwb eng Asrafali, Shakila Parveen verfasserin (orcid)0000-0002-2638-5477 aut Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties 2022 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Polymer Society, Taipei 2022 Abstract Polymers play an integral part in the semiconductor electronic industry. Low dielectric constant materials (k < 3.0) have the advantage of facilitating manufacture of high performance integrated circuit (IC) devices with decreasing feature size of the chip. In this work, two different approaches has been put forth to produce low dielectric materials from polybenzoxazines (Pbzs). At first benzoxazine (Bzo) monomers with different functionalities such as nitrile, benzophenone and azo groups in their backbone were synthesized. And secondly, Pbz/$ SiO_{2} $ nanocomposites were prepared using the synthesized monomers and $ SiO_{2} $ nanoparticles (NPs). Simple Mannich reaction and thermal curing were effective for synthesizing the ring closure and ring opening benzoxazines via molecular designs and provided high yield products without using any specific catalyst. DSC analysis showed that the benzoxazine monomers exhibit different reactivity towards polymerization as it possesses different functional groups. The inclusion of the inorganic component into the organic polymer had a significant enhancing effect on both thermal and mechanical properties of polybenzoxazine. An increase in thermal and mechanical property and a decrease in dielectric property are observed on increasing the addition of silica nanoparticles to the benzoxazine matrix. Polybenzoxazine (dpeaa)DE-He213 Silica nanoparticles (dpeaa)DE-He213 Nanocomposites (dpeaa)DE-He213 Low dielectric materials (dpeaa)DE-He213 Periyasamy, Thirukumaran aut Haldhar, Rajesh aut Madhappan, Santhamoorthy aut Kim, Seong-Cheol aut Enthalten in Journal of polymer research Dordrecht : Springer Science + Business Media B.V., 1994 29(2022), 5 vom: 21. Apr. (DE-627)340872098 (DE-600)2065616-6 1572-8935 nnns volume:29 year:2022 number:5 day:21 month:04 https://dx.doi.org/10.1007/s10965-022-03010-9 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 29 2022 5 21 04 |
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10.1007/s10965-022-03010-9 doi (DE-627)SPR046809600 (SPR)s10965-022-03010-9-e DE-627 ger DE-627 rakwb eng Asrafali, Shakila Parveen verfasserin (orcid)0000-0002-2638-5477 aut Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties 2022 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Polymer Society, Taipei 2022 Abstract Polymers play an integral part in the semiconductor electronic industry. Low dielectric constant materials (k < 3.0) have the advantage of facilitating manufacture of high performance integrated circuit (IC) devices with decreasing feature size of the chip. In this work, two different approaches has been put forth to produce low dielectric materials from polybenzoxazines (Pbzs). At first benzoxazine (Bzo) monomers with different functionalities such as nitrile, benzophenone and azo groups in their backbone were synthesized. And secondly, Pbz/$ SiO_{2} $ nanocomposites were prepared using the synthesized monomers and $ SiO_{2} $ nanoparticles (NPs). Simple Mannich reaction and thermal curing were effective for synthesizing the ring closure and ring opening benzoxazines via molecular designs and provided high yield products without using any specific catalyst. DSC analysis showed that the benzoxazine monomers exhibit different reactivity towards polymerization as it possesses different functional groups. The inclusion of the inorganic component into the organic polymer had a significant enhancing effect on both thermal and mechanical properties of polybenzoxazine. An increase in thermal and mechanical property and a decrease in dielectric property are observed on increasing the addition of silica nanoparticles to the benzoxazine matrix. Polybenzoxazine (dpeaa)DE-He213 Silica nanoparticles (dpeaa)DE-He213 Nanocomposites (dpeaa)DE-He213 Low dielectric materials (dpeaa)DE-He213 Periyasamy, Thirukumaran aut Haldhar, Rajesh aut Madhappan, Santhamoorthy aut Kim, Seong-Cheol aut Enthalten in Journal of polymer research Dordrecht : Springer Science + Business Media B.V., 1994 29(2022), 5 vom: 21. Apr. (DE-627)340872098 (DE-600)2065616-6 1572-8935 nnns volume:29 year:2022 number:5 day:21 month:04 https://dx.doi.org/10.1007/s10965-022-03010-9 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 29 2022 5 21 04 |
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Polybenzoxazine Silica nanoparticles Nanocomposites Low dielectric materials |
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Asrafali, Shakila Parveen @@aut@@ Periyasamy, Thirukumaran @@aut@@ Haldhar, Rajesh @@aut@@ Madhappan, Santhamoorthy @@aut@@ Kim, Seong-Cheol @@aut@@ |
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| author |
Asrafali, Shakila Parveen |
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Asrafali, Shakila Parveen misc Polybenzoxazine misc Silica nanoparticles misc Nanocomposites misc Low dielectric materials Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties |
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Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties Polybenzoxazine (dpeaa)DE-He213 Silica nanoparticles (dpeaa)DE-He213 Nanocomposites (dpeaa)DE-He213 Low dielectric materials (dpeaa)DE-He213 |
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Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties |
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Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties |
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Asrafali, Shakila Parveen |
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Journal of polymer research |
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Asrafali, Shakila Parveen Periyasamy, Thirukumaran Haldhar, Rajesh Madhappan, Santhamoorthy Kim, Seong-Cheol |
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Asrafali, Shakila Parveen |
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fabrication of $ sio_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties |
| title_auth |
Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties |
| abstract |
Abstract Polymers play an integral part in the semiconductor electronic industry. Low dielectric constant materials (k < 3.0) have the advantage of facilitating manufacture of high performance integrated circuit (IC) devices with decreasing feature size of the chip. In this work, two different approaches has been put forth to produce low dielectric materials from polybenzoxazines (Pbzs). At first benzoxazine (Bzo) monomers with different functionalities such as nitrile, benzophenone and azo groups in their backbone were synthesized. And secondly, Pbz/$ SiO_{2} $ nanocomposites were prepared using the synthesized monomers and $ SiO_{2} $ nanoparticles (NPs). Simple Mannich reaction and thermal curing were effective for synthesizing the ring closure and ring opening benzoxazines via molecular designs and provided high yield products without using any specific catalyst. DSC analysis showed that the benzoxazine monomers exhibit different reactivity towards polymerization as it possesses different functional groups. The inclusion of the inorganic component into the organic polymer had a significant enhancing effect on both thermal and mechanical properties of polybenzoxazine. An increase in thermal and mechanical property and a decrease in dielectric property are observed on increasing the addition of silica nanoparticles to the benzoxazine matrix. © The Polymer Society, Taipei 2022 |
| abstractGer |
Abstract Polymers play an integral part in the semiconductor electronic industry. Low dielectric constant materials (k < 3.0) have the advantage of facilitating manufacture of high performance integrated circuit (IC) devices with decreasing feature size of the chip. In this work, two different approaches has been put forth to produce low dielectric materials from polybenzoxazines (Pbzs). At first benzoxazine (Bzo) monomers with different functionalities such as nitrile, benzophenone and azo groups in their backbone were synthesized. And secondly, Pbz/$ SiO_{2} $ nanocomposites were prepared using the synthesized monomers and $ SiO_{2} $ nanoparticles (NPs). Simple Mannich reaction and thermal curing were effective for synthesizing the ring closure and ring opening benzoxazines via molecular designs and provided high yield products without using any specific catalyst. DSC analysis showed that the benzoxazine monomers exhibit different reactivity towards polymerization as it possesses different functional groups. The inclusion of the inorganic component into the organic polymer had a significant enhancing effect on both thermal and mechanical properties of polybenzoxazine. An increase in thermal and mechanical property and a decrease in dielectric property are observed on increasing the addition of silica nanoparticles to the benzoxazine matrix. © The Polymer Society, Taipei 2022 |
| abstract_unstemmed |
Abstract Polymers play an integral part in the semiconductor electronic industry. Low dielectric constant materials (k < 3.0) have the advantage of facilitating manufacture of high performance integrated circuit (IC) devices with decreasing feature size of the chip. In this work, two different approaches has been put forth to produce low dielectric materials from polybenzoxazines (Pbzs). At first benzoxazine (Bzo) monomers with different functionalities such as nitrile, benzophenone and azo groups in their backbone were synthesized. And secondly, Pbz/$ SiO_{2} $ nanocomposites were prepared using the synthesized monomers and $ SiO_{2} $ nanoparticles (NPs). Simple Mannich reaction and thermal curing were effective for synthesizing the ring closure and ring opening benzoxazines via molecular designs and provided high yield products without using any specific catalyst. DSC analysis showed that the benzoxazine monomers exhibit different reactivity towards polymerization as it possesses different functional groups. The inclusion of the inorganic component into the organic polymer had a significant enhancing effect on both thermal and mechanical properties of polybenzoxazine. An increase in thermal and mechanical property and a decrease in dielectric property are observed on increasing the addition of silica nanoparticles to the benzoxazine matrix. © The Polymer Society, Taipei 2022 |
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Fabrication of $ SiO_{2} $-reinforced polybenzoxazine composites and their thermal and dielectric properties |
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https://dx.doi.org/10.1007/s10965-022-03010-9 |
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Periyasamy, Thirukumaran Haldhar, Rajesh Madhappan, Santhamoorthy Kim, Seong-Cheol |
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Periyasamy, Thirukumaran Haldhar, Rajesh Madhappan, Santhamoorthy Kim, Seong-Cheol |
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10.1007/s10965-022-03010-9 |
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2024-07-04T00:31:16.262Z |
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|
| score |
7.399926 |