Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys
Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn inte...
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Gespeichert in:
| Autor*in: |
Fowler, Hannah N. [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2023 |
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| Anmerkung: |
© The Minerals, Metals & Materials Society 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
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| Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Warrendale, Pa : TMS, 1972, 53(2023), 3 vom: 27. Dez., Seite 1284-1298 |
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| Übergeordnetes Werk: |
volume:53 ; year:2023 ; number:3 ; day:27 ; month:12 ; pages:1284-1298 |
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| DOI / URN: |
10.1007/s11664-023-10866-0 |
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SPR054612136 |
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| 520 | |a Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn intermetallic on microstructural evolution and the resulting mechanical properties as a way to explain the thermal cycling behavior. Most importantly, the Sb in solid solution in these alloys resulted in higher strength and improved creep resistance when compared to eutectic Sn-Bi. In contrast to Sn-Pb and Sn-Ag-Cu Pb-free alloys, all the near-eutectic Sn-Bi alloys tested showed significant age hardening. In both the unaged and aged conditions, both Sb and Ag additions individually increased the saturation stress of the eutectic Sn-Bi solder joint, but Ag had a more significant effect. However, when both Sb and Ag were added to eutectic Sn-Bi, the saturation stress was lower than when 1 wt.% Ag alone was added. In terms of relative behavior, the Sb-free 42Sn-Bi-1Ag aged for 250 h had the highest saturation stress of all tested alloys, while as-reflowed eutectic Sn-Bi had the lowest saturation stress. These results suggest that the alloy design strategy for Sn-Ag-Cu alloys, i.e., assuming that the effects of individual alloying elements are additive and independent, is not valid when Sb is added to Sn-Bi low-temperature solder. Graphical Abstract | ||
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10.1007/s11664-023-10866-0 doi (DE-627)SPR054612136 (SPR)s11664-023-10866-0-e DE-627 ger DE-627 rakwb eng Fowler, Hannah N. verfasserin (orcid)0000-0002-1210-7492 aut Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys 2023 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn intermetallic on microstructural evolution and the resulting mechanical properties as a way to explain the thermal cycling behavior. Most importantly, the Sb in solid solution in these alloys resulted in higher strength and improved creep resistance when compared to eutectic Sn-Bi. In contrast to Sn-Pb and Sn-Ag-Cu Pb-free alloys, all the near-eutectic Sn-Bi alloys tested showed significant age hardening. In both the unaged and aged conditions, both Sb and Ag additions individually increased the saturation stress of the eutectic Sn-Bi solder joint, but Ag had a more significant effect. However, when both Sb and Ag were added to eutectic Sn-Bi, the saturation stress was lower than when 1 wt.% Ag alone was added. In terms of relative behavior, the Sb-free 42Sn-Bi-1Ag aged for 250 h had the highest saturation stress of all tested alloys, while as-reflowed eutectic Sn-Bi had the lowest saturation stress. These results suggest that the alloy design strategy for Sn-Ag-Cu alloys, i.e., assuming that the effects of individual alloying elements are additive and independent, is not valid when Sb is added to Sn-Bi low-temperature solder. Graphical Abstract Low-temperature solder (dpeaa)DE-He213 lead-free (dpeaa)DE-He213 eutectic Sn-Bi (dpeaa)DE-He213 mechanical testing (dpeaa)DE-He213 aging study (dpeaa)DE-He213 Puttur Lakshminarayana, Sukshitha Achar aut Lai, Sean Yenyu aut Tay, Sui Xiong aut Masaeng, Aleena aut Subbarayan, Ganesh aut Blendell, John E. aut Handwerker, Carol A. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 53(2023), 3 vom: 27. Dez., Seite 1284-1298 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:53 year:2023 number:3 day:27 month:12 pages:1284-1298 https://dx.doi.org/10.1007/s11664-023-10866-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 53 2023 3 27 12 1284-1298 |
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10.1007/s11664-023-10866-0 doi (DE-627)SPR054612136 (SPR)s11664-023-10866-0-e DE-627 ger DE-627 rakwb eng Fowler, Hannah N. verfasserin (orcid)0000-0002-1210-7492 aut Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys 2023 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn intermetallic on microstructural evolution and the resulting mechanical properties as a way to explain the thermal cycling behavior. Most importantly, the Sb in solid solution in these alloys resulted in higher strength and improved creep resistance when compared to eutectic Sn-Bi. In contrast to Sn-Pb and Sn-Ag-Cu Pb-free alloys, all the near-eutectic Sn-Bi alloys tested showed significant age hardening. In both the unaged and aged conditions, both Sb and Ag additions individually increased the saturation stress of the eutectic Sn-Bi solder joint, but Ag had a more significant effect. However, when both Sb and Ag were added to eutectic Sn-Bi, the saturation stress was lower than when 1 wt.% Ag alone was added. In terms of relative behavior, the Sb-free 42Sn-Bi-1Ag aged for 250 h had the highest saturation stress of all tested alloys, while as-reflowed eutectic Sn-Bi had the lowest saturation stress. These results suggest that the alloy design strategy for Sn-Ag-Cu alloys, i.e., assuming that the effects of individual alloying elements are additive and independent, is not valid when Sb is added to Sn-Bi low-temperature solder. Graphical Abstract Low-temperature solder (dpeaa)DE-He213 lead-free (dpeaa)DE-He213 eutectic Sn-Bi (dpeaa)DE-He213 mechanical testing (dpeaa)DE-He213 aging study (dpeaa)DE-He213 Puttur Lakshminarayana, Sukshitha Achar aut Lai, Sean Yenyu aut Tay, Sui Xiong aut Masaeng, Aleena aut Subbarayan, Ganesh aut Blendell, John E. aut Handwerker, Carol A. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 53(2023), 3 vom: 27. Dez., Seite 1284-1298 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:53 year:2023 number:3 day:27 month:12 pages:1284-1298 https://dx.doi.org/10.1007/s11664-023-10866-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 53 2023 3 27 12 1284-1298 |
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10.1007/s11664-023-10866-0 doi (DE-627)SPR054612136 (SPR)s11664-023-10866-0-e DE-627 ger DE-627 rakwb eng Fowler, Hannah N. verfasserin (orcid)0000-0002-1210-7492 aut Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys 2023 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn intermetallic on microstructural evolution and the resulting mechanical properties as a way to explain the thermal cycling behavior. Most importantly, the Sb in solid solution in these alloys resulted in higher strength and improved creep resistance when compared to eutectic Sn-Bi. In contrast to Sn-Pb and Sn-Ag-Cu Pb-free alloys, all the near-eutectic Sn-Bi alloys tested showed significant age hardening. In both the unaged and aged conditions, both Sb and Ag additions individually increased the saturation stress of the eutectic Sn-Bi solder joint, but Ag had a more significant effect. However, when both Sb and Ag were added to eutectic Sn-Bi, the saturation stress was lower than when 1 wt.% Ag alone was added. In terms of relative behavior, the Sb-free 42Sn-Bi-1Ag aged for 250 h had the highest saturation stress of all tested alloys, while as-reflowed eutectic Sn-Bi had the lowest saturation stress. These results suggest that the alloy design strategy for Sn-Ag-Cu alloys, i.e., assuming that the effects of individual alloying elements are additive and independent, is not valid when Sb is added to Sn-Bi low-temperature solder. Graphical Abstract Low-temperature solder (dpeaa)DE-He213 lead-free (dpeaa)DE-He213 eutectic Sn-Bi (dpeaa)DE-He213 mechanical testing (dpeaa)DE-He213 aging study (dpeaa)DE-He213 Puttur Lakshminarayana, Sukshitha Achar aut Lai, Sean Yenyu aut Tay, Sui Xiong aut Masaeng, Aleena aut Subbarayan, Ganesh aut Blendell, John E. aut Handwerker, Carol A. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 53(2023), 3 vom: 27. Dez., Seite 1284-1298 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:53 year:2023 number:3 day:27 month:12 pages:1284-1298 https://dx.doi.org/10.1007/s11664-023-10866-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 53 2023 3 27 12 1284-1298 |
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10.1007/s11664-023-10866-0 doi (DE-627)SPR054612136 (SPR)s11664-023-10866-0-e DE-627 ger DE-627 rakwb eng Fowler, Hannah N. verfasserin (orcid)0000-0002-1210-7492 aut Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys 2023 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn intermetallic on microstructural evolution and the resulting mechanical properties as a way to explain the thermal cycling behavior. Most importantly, the Sb in solid solution in these alloys resulted in higher strength and improved creep resistance when compared to eutectic Sn-Bi. In contrast to Sn-Pb and Sn-Ag-Cu Pb-free alloys, all the near-eutectic Sn-Bi alloys tested showed significant age hardening. In both the unaged and aged conditions, both Sb and Ag additions individually increased the saturation stress of the eutectic Sn-Bi solder joint, but Ag had a more significant effect. However, when both Sb and Ag were added to eutectic Sn-Bi, the saturation stress was lower than when 1 wt.% Ag alone was added. In terms of relative behavior, the Sb-free 42Sn-Bi-1Ag aged for 250 h had the highest saturation stress of all tested alloys, while as-reflowed eutectic Sn-Bi had the lowest saturation stress. These results suggest that the alloy design strategy for Sn-Ag-Cu alloys, i.e., assuming that the effects of individual alloying elements are additive and independent, is not valid when Sb is added to Sn-Bi low-temperature solder. Graphical Abstract Low-temperature solder (dpeaa)DE-He213 lead-free (dpeaa)DE-He213 eutectic Sn-Bi (dpeaa)DE-He213 mechanical testing (dpeaa)DE-He213 aging study (dpeaa)DE-He213 Puttur Lakshminarayana, Sukshitha Achar aut Lai, Sean Yenyu aut Tay, Sui Xiong aut Masaeng, Aleena aut Subbarayan, Ganesh aut Blendell, John E. aut Handwerker, Carol A. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 53(2023), 3 vom: 27. Dez., Seite 1284-1298 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:53 year:2023 number:3 day:27 month:12 pages:1284-1298 https://dx.doi.org/10.1007/s11664-023-10866-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 53 2023 3 27 12 1284-1298 |
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10.1007/s11664-023-10866-0 doi (DE-627)SPR054612136 (SPR)s11664-023-10866-0-e DE-627 ger DE-627 rakwb eng Fowler, Hannah N. verfasserin (orcid)0000-0002-1210-7492 aut Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys 2023 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn intermetallic on microstructural evolution and the resulting mechanical properties as a way to explain the thermal cycling behavior. Most importantly, the Sb in solid solution in these alloys resulted in higher strength and improved creep resistance when compared to eutectic Sn-Bi. In contrast to Sn-Pb and Sn-Ag-Cu Pb-free alloys, all the near-eutectic Sn-Bi alloys tested showed significant age hardening. In both the unaged and aged conditions, both Sb and Ag additions individually increased the saturation stress of the eutectic Sn-Bi solder joint, but Ag had a more significant effect. However, when both Sb and Ag were added to eutectic Sn-Bi, the saturation stress was lower than when 1 wt.% Ag alone was added. In terms of relative behavior, the Sb-free 42Sn-Bi-1Ag aged for 250 h had the highest saturation stress of all tested alloys, while as-reflowed eutectic Sn-Bi had the lowest saturation stress. These results suggest that the alloy design strategy for Sn-Ag-Cu alloys, i.e., assuming that the effects of individual alloying elements are additive and independent, is not valid when Sb is added to Sn-Bi low-temperature solder. Graphical Abstract Low-temperature solder (dpeaa)DE-He213 lead-free (dpeaa)DE-He213 eutectic Sn-Bi (dpeaa)DE-He213 mechanical testing (dpeaa)DE-He213 aging study (dpeaa)DE-He213 Puttur Lakshminarayana, Sukshitha Achar aut Lai, Sean Yenyu aut Tay, Sui Xiong aut Masaeng, Aleena aut Subbarayan, Ganesh aut Blendell, John E. aut Handwerker, Carol A. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 53(2023), 3 vom: 27. Dez., Seite 1284-1298 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:53 year:2023 number:3 day:27 month:12 pages:1284-1298 https://dx.doi.org/10.1007/s11664-023-10866-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 53 2023 3 27 12 1284-1298 |
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Fowler, Hannah N. @@aut@@ Puttur Lakshminarayana, Sukshitha Achar @@aut@@ Lai, Sean Yenyu @@aut@@ Tay, Sui Xiong @@aut@@ Masaeng, Aleena @@aut@@ Subbarayan, Ganesh @@aut@@ Blendell, John E. @@aut@@ Handwerker, Carol A. @@aut@@ |
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Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn intermetallic on microstructural evolution and the resulting mechanical properties as a way to explain the thermal cycling behavior. Most importantly, the Sb in solid solution in these alloys resulted in higher strength and improved creep resistance when compared to eutectic Sn-Bi. In contrast to Sn-Pb and Sn-Ag-Cu Pb-free alloys, all the near-eutectic Sn-Bi alloys tested showed significant age hardening. In both the unaged and aged conditions, both Sb and Ag additions individually increased the saturation stress of the eutectic Sn-Bi solder joint, but Ag had a more significant effect. However, when both Sb and Ag were added to eutectic Sn-Bi, the saturation stress was lower than when 1 wt.% Ag alone was added. In terms of relative behavior, the Sb-free 42Sn-Bi-1Ag aged for 250 h had the highest saturation stress of all tested alloys, while as-reflowed eutectic Sn-Bi had the lowest saturation stress. These results suggest that the alloy design strategy for Sn-Ag-Cu alloys, i.e., assuming that the effects of individual alloying elements are additive and independent, is not valid when Sb is added to Sn-Bi low-temperature solder. 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Fowler, Hannah N. |
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Fowler, Hannah N. misc Low-temperature solder misc lead-free misc eutectic Sn-Bi misc mechanical testing misc aging study Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys |
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Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys Low-temperature solder (dpeaa)DE-He213 lead-free (dpeaa)DE-He213 eutectic Sn-Bi (dpeaa)DE-He213 mechanical testing (dpeaa)DE-He213 aging study (dpeaa)DE-He213 |
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Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys |
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Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys |
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Fowler, Hannah N. Puttur Lakshminarayana, Sukshitha Achar Lai, Sean Yenyu Tay, Sui Xiong Masaeng, Aleena Subbarayan, Ganesh Blendell, John E. Handwerker, Carol A. |
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effect of sb and ag addition and aging on the microstructural evolution, imc layer growth, and mechanical properties of near-eutectic sn-bi alloys |
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Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys |
| abstract |
Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn intermetallic on microstructural evolution and the resulting mechanical properties as a way to explain the thermal cycling behavior. Most importantly, the Sb in solid solution in these alloys resulted in higher strength and improved creep resistance when compared to eutectic Sn-Bi. In contrast to Sn-Pb and Sn-Ag-Cu Pb-free alloys, all the near-eutectic Sn-Bi alloys tested showed significant age hardening. In both the unaged and aged conditions, both Sb and Ag additions individually increased the saturation stress of the eutectic Sn-Bi solder joint, but Ag had a more significant effect. However, when both Sb and Ag were added to eutectic Sn-Bi, the saturation stress was lower than when 1 wt.% Ag alone was added. In terms of relative behavior, the Sb-free 42Sn-Bi-1Ag aged for 250 h had the highest saturation stress of all tested alloys, while as-reflowed eutectic Sn-Bi had the lowest saturation stress. These results suggest that the alloy design strategy for Sn-Ag-Cu alloys, i.e., assuming that the effects of individual alloying elements are additive and independent, is not valid when Sb is added to Sn-Bi low-temperature solder. Graphical Abstract © The Minerals, Metals & Materials Society 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
| abstractGer |
Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn intermetallic on microstructural evolution and the resulting mechanical properties as a way to explain the thermal cycling behavior. Most importantly, the Sb in solid solution in these alloys resulted in higher strength and improved creep resistance when compared to eutectic Sn-Bi. In contrast to Sn-Pb and Sn-Ag-Cu Pb-free alloys, all the near-eutectic Sn-Bi alloys tested showed significant age hardening. In both the unaged and aged conditions, both Sb and Ag additions individually increased the saturation stress of the eutectic Sn-Bi solder joint, but Ag had a more significant effect. However, when both Sb and Ag were added to eutectic Sn-Bi, the saturation stress was lower than when 1 wt.% Ag alone was added. In terms of relative behavior, the Sb-free 42Sn-Bi-1Ag aged for 250 h had the highest saturation stress of all tested alloys, while as-reflowed eutectic Sn-Bi had the lowest saturation stress. These results suggest that the alloy design strategy for Sn-Ag-Cu alloys, i.e., assuming that the effects of individual alloying elements are additive and independent, is not valid when Sb is added to Sn-Bi low-temperature solder. Graphical Abstract © The Minerals, Metals & Materials Society 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
| abstract_unstemmed |
Low-melting-point Sn-Bi solder joints (melting point: 139°C) show remarkable resistance to damage accumulation during aggressive thermal cycling. In this study, we used isothermal aging at 85°C of near eutectic Sn-Bi solder joints to determine the effect of Sb in solid solution and $ Ag_{3} $Sn intermetallic on microstructural evolution and the resulting mechanical properties as a way to explain the thermal cycling behavior. Most importantly, the Sb in solid solution in these alloys resulted in higher strength and improved creep resistance when compared to eutectic Sn-Bi. In contrast to Sn-Pb and Sn-Ag-Cu Pb-free alloys, all the near-eutectic Sn-Bi alloys tested showed significant age hardening. In both the unaged and aged conditions, both Sb and Ag additions individually increased the saturation stress of the eutectic Sn-Bi solder joint, but Ag had a more significant effect. However, when both Sb and Ag were added to eutectic Sn-Bi, the saturation stress was lower than when 1 wt.% Ag alone was added. In terms of relative behavior, the Sb-free 42Sn-Bi-1Ag aged for 250 h had the highest saturation stress of all tested alloys, while as-reflowed eutectic Sn-Bi had the lowest saturation stress. These results suggest that the alloy design strategy for Sn-Ag-Cu alloys, i.e., assuming that the effects of individual alloying elements are additive and independent, is not valid when Sb is added to Sn-Bi low-temperature solder. Graphical Abstract © The Minerals, Metals & Materials Society 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
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3 |
| title_short |
Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys |
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https://dx.doi.org/10.1007/s11664-023-10866-0 |
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Puttur Lakshminarayana, Sukshitha Achar Lai, Sean Yenyu Tay, Sui Xiong Masaeng, Aleena Subbarayan, Ganesh Blendell, John E. Handwerker, Carol A. |
| author2Str |
Puttur Lakshminarayana, Sukshitha Achar Lai, Sean Yenyu Tay, Sui Xiong Masaeng, Aleena Subbarayan, Ganesh Blendell, John E. Handwerker, Carol A. |
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2024-07-04T02:22:09.230Z |
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| score |
7.3994894 |