Effect of Minor Addition of Ni on the Microstructure and Properties of Zn-Based High-Temperature Solder

Abstract Lead-based solders are widely used for making interconnections between electronic chips and a circuit board that is expected to perform at high temperatures. The substitution of traditional lead-bearing solders is one of the key challenges to electronic industries in the current drive for e...
Ausführliche Beschreibung

Gespeichert in:
Autor*in:

Hasan, M. M. [verfasserIn]

Sharif, A. [verfasserIn]

Gafur, M. A. [verfasserIn]

Format:

E-Artikel

Sprache:

Englisch

Erschienen:

2020

Schlagwörter:

Pb-free solder

high-temperature solder

microstructure

mechanical properties

electrical properties

Übergeordnetes Werk:

Enthalten in: Journal of electronic materials - Warrendale, Pa : TMS, 1972, 49(2020), 6 vom: 02. Apr., Seite 3990-4001

Übergeordnetes Werk:

volume:49 ; year:2020 ; number:6 ; day:02 ; month:04 ; pages:3990-4001

Links:

Volltext

DOI / URN:

10.1007/s11664-020-08089-8

Katalog-ID:

SPR039547485

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